钴离子和镍离子用量对电镀硬金层显微硬度和电接触性能的影响

摘要

为了在提高零件表面金层硬度的同时不降低表面电接触性能,在普通镀金液中加入0.2 ～ 0.6 g/L钴或0.1 ～ 0.5 g/L镍离子,电镀得到了金黄色的Au?Co合金镀层(Co质量分数为0.1% ～ 0.7%)和Au?Ni合金镀层(Ni质量分数为0.2% ～ 1.6%),其显微硬度分别为150 ～ 190 HV和170 ～ 250 HV.2种硬金层都均匀、细致,结合力良好,接触电阻低于2 mΩ.降低黄铜基体的表面粗糙度有利于降低硬金层的接触电阻.%To improve the hardness of a component without reducing its surface electrical contact performance, 0.2-0.6 g/L of cobalt ions or 0.1-0.5 g/L of nickel ions were added to a normal gold electroplating bath, from which an Au?Co alloy coating containing 0.1-0.7wt.% Co or an Au?Ni alloy coating containing 0.2-1.6wt.% Ni in golden color was obtained. The microhardness was 150-190 HV for the former and 170-250 HV for the latter. Both hard gold coatings were uniform and compact with a good adhesion, and a contact resistance 2 mΩ below. The decrease in surface roughness of brass substrate facilitated to reduce the contact resistance of hard gold coatings.