电子接插件镍-磷合金中间层电镀工艺

摘要

A continuous roll-to-roll process for electroplating production of connectors in electronic industry was introduced. The process flow includes chemical degreasing, anodic electro-degreasing, activating, sulfamate Ni electroplating, sulfamate Ni-P alloy electroplating, selective Au electroplating, selective bright Sn electroplating anti-tarnishing for Sn layer, sealing for Au layer, and drying. The effects of bath composition and operation conditions on the electroplating of Ni-P alloy as medium layer from a sulfamate bath were described. The technological maintenance and methods for treating impurities were given.%介绍了一种电子行业接触件连续电镀生产线所用的卷对卷连续工艺,其流程主要包括化学除油、阳极电解除油、活化、镀氨基磺酸镍、镀氨基磺酸镍-磷合金、选择性镀金、选择性镀亮锡、锡防变色、金封孔和烘干.说明了氨基磺酸盐体系电镀镍-磷合金中间层工艺中镀液成分及操作条件对镀层结构和物性的影响,给出了工艺维护以及杂质处理的方法.