采用自制的镀银铜粉制备了导电涂料,研究了导电填料的用量和涂层厚度对涂层导电性的影响,以及导电涂层的抗电迁移和老化性能.结果发现,导电涂层的电阻率随导电填料的用量及涂层厚度的增加而逐渐下降,然后趋于平缓.适宜的镀银铜粉的用量为60％,涂层厚度为120 μm.在100℃以内,涂层具有良好的导电性；超过100℃后,涂层电阻率急剧增大,导电性下降.含镀银铜粉的涂层较含纯银粉涂层具有明显的抗电迁移性.%A conductive coating was prepared using the home-made silver-plated copper powder. The effects of the dosage of conductive filler and coating thickness on electric conductivity of the coating, as well as the anti-electromigration and anti-aging performance of the conductive coating were studied. It was found that the conductivity of the coating decreases gradually then levels off with increasing dosage of conductive filler and coating thickness. The suitable dosage of silver-plated copper powder is 60% and the optimal coating thickness is 120 urn. The coating has good electric conductivity within 100 ℃, but becomes poorly conductive due to the drastic increase in resistivity while the temperature exceeds 100 °C. The coating containing silver-plated copper powder has obvious anti-electromigration in comparison with the coating containing pure silver powder.
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