Sintered electronic silver paste was prepared with silver flask as the filler, glass powder as binder and ethyl cellulose and terpineol and triton as organic carrier. The microstructure conductivity and adhesion of the sintered silver paste were investigated by scanning electron microscopy, sheet resistance instrument and adhesion test procedure. The results show that the microstructure conductivity and adhesion of the sintered silver paste are affected by the sintering temperature, glass powder content and conductive materials. The sintering temperature influences not only the melting of glass powder, but also the densification of silver flasks and the wettability between substrate and glass powder. The glass powder content is the main factor to influence the conductivity and the adhesion of the sintered silver paste. The conductivity and adhesion of the sintered silver paste decrease after doping silver nanoparticles into silver flasks due to the decrease of the densification of the conductive particles.%采用商用微米银片为导电相,玻璃粉为粘结剂,乙基纤维素、松油醇和曲拉通为有机载体制备了烧渗型银浆.利用扫描电子显微镜、方阻仪和百格测试法对烧结银浆的显微结构、导电性和附着力进行表征和研究.实验结果表明:烧结温度、玻璃粉含量和导电相的性质对银浆烧结后的显微结构、导电性和附着力均有较大影响.其中,烧结温度不仅对玻璃粉的熔化情况有影响,而且对烧结后的银浆中银片间的接触程度和与基材的润湿性等也有影响;玻璃粉的含量是影响烧结银浆的导电性和附着力的主要因素;微米银片中掺杂纳米银会导致烧结体中导电颗粒间的致密性下降,进而导致烧结后的银浆的导电性和附着力均下降.
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