低黏度灌注环氧树脂体系工艺性能研究

摘要

The data of viscosity vs time of E230E/E234H infusion epoxy resin system had been tested. By plotting the viscosity contour of time vs temperature, it believed that the best infusion temperature was 25 ℃. By the method of rheology simulation, it got the relationship of epoxy resin viscosity vs time and temperature, the relationship of flow distance vs time under a specified temper-ature, and the relationship of flow distance vs temperature under a specified viscosity. It believed that the higher temperature, the better process performance. It also discussed the difference between the actual use situation and the isothermal simulation, and found the condition of actual use situation when the epoxy resin system had the best process performance.%文章测试了不同温度下 E230E/E234H 灌注环氧树脂体系的黏度随时间的变化数据。通过绘制时间随温度变化的黏度等高线图的方法，认为最佳灌注温度为25℃左右。通过流变学模拟的方法，得到树脂黏度与时间、温度之间的关系式，以及指定温度下流动距离与时间、指定黏度下流动距离与温度之间的关系式，认为灌注温度越高，工艺性能越好。还讨论了实际运用情况与等温模拟之间的差异，给出了实际运用情况下环氧树脂体系拥有最佳工艺性能的条件。