Resilient epoxy resin system, the use of an epoxy resin system, optoelectronic component and a process for the preparation of an epoxy resin system

摘要

The present invention relates to a resilient epoxy resin system comprising at least one inorganic filler (f) with an upper particle size (d_{a maximum}) of a maximum of 30 μm, of an oxide or nitride of a metal or semimetal, is at least a cycloaliphatic epoxy resin, polyvinyl butyrate, at least one cationic accelerators, and wherein the resilient epoxy resin system a a - components - a system for thin-walled structural elements is.