金刚石超薄切割砂轮减薄研磨工艺的研究

摘要

采用金刚石游离磨料对真空热压烧结后的金刚石超薄切割砂轮毛坯进行研磨减薄,研究了游离磨料的进料方式、砂轮的固定方式、单面研磨时间、铸铁盘转速、磨料粒度、研磨压力等研磨工艺参数对减薄金刚石超薄切割砂轮效果的影响.实验中金刚石砂轮的厚度从0.5 mm减薄到0.38 mm.工艺参数实验结果表明:可以通过调整研磨过程中各项参数,提高超薄切割砂轮厚度尺寸均匀性和降低金刚石超薄切割砂轮的相对翘曲度,实现对金刚石超薄切割砂轮的精密加工.%The free diamond abrasive was used for thinning the diamond ultrathin cutting wheel which was sintered by vacuum hot pressing. The influences of lapping parameters on the results were discussed, such as the feeding way of free abrasive, the fixed mode of cutting wheel, the time of single side lapping, the speed of cast iron plate, the size of abrasive grains and the pressure of lapping thinning. Results showed that the thickness of diamond cutting wheel decreased from 0.5 mm to 0. 38 mm, and that the thickness uniformity was improved and the relative warp degree of diamond ultrathin cutting wheel was reduced.