Cu/diamond composites were prepared by high temperature and high pressure (HTHP) method. Factors including diamond grit size, the volume ratio of two sizes of diamond, the volume ratio of Cu and diamond, and the time of pressure maintaining and heat preservation were investigated to illustrate their influences on the thermal conductivity of composites based on orthogonal experiments. The results showed that the volume ratio of Cu and diamond was the most pivotal factor, while the volume ratio of two sizes of diamond was the least impact on the thermal conductivity. In order to improve the thermal conductivity of Cu/diamond composites, the optimized preparation process parameters were studied and obtained as follows; the volume ratio of large size (250 (μm) diamond to the small size (75μm) diamond was 1:4, the volume ratio of Cu and diamond was 7-3, the time of pressure maintaining was 2 h. Under the optimized parameters, Cu/diamond composites with thermal conductivity of 238. 18 W/(m · K) were obtained.%采用高温高压法制备了铜/金刚石复合材料.通过正交实验法研究了复合材料中金刚石粒度的不同尺寸和对应的体积比、铜和金刚石的体积比及保压保温时间等各种因素对复合材料热导率的影响.结果表明:铜和金刚石的体积比因素对热导率的影响最大,而金刚石不同粒度的体积比影响最小.获得了基于提高复合材料热导率的最佳制备工艺条件是,配料中金刚石粒度尺寸为75μm和250 μm,金刚石大小粒度的配料体积比为1∶4,铜和金刚石的配料体积比为7∶3和保压保温时间为2h,该工艺条件下制备的复合材料热导率为238.18 W/(m·K).
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