Cu-Sn-Ti 金属结合剂的制备及形成机理的研究

摘要

以铜、钛等为原料,采用真空热压法制备 Cu–Sn–Ti 金属结合剂。烧结工艺参数：烧结气氛,真空；烧结温度,640℃；烧结压力,23 kN/mm2；保温时间,6 min。利用 Inspect S50扫描电子显微镜对其微观结构进行表征。实验结果表明：Cu-Sn-Ti 金属结合剂中形成了以钛为中心、Cu-Sn 相为壳的核/壳结构,即 Ti/Ti-Cu/Ti-Cu-Sn/Cu-Sn 的微观结构。最后,结合烧结工艺参数、原子特性、热力学分析等,对这种微观结构的形成机理进行了阐述。%Using the vacuum hot-pressing technology Cu-Sn-Ti metal bond was prepared with copper titanium etc whose sintering process parameters were as follows vacuum atmosphere 640 ℃pressure 23 kN mm2 and holding time 6 min Inspect S50 SEM was used to research micro-structure of Cu-Sn-Ti metal bond The results showed that the corn shell structure was obtained whose center was Ti and the edge was Cu-Sn and that its composition were Ti Ti-Cu Ti-Cu-Sn Cu-Sn The formation mechanism of micro-structure of Cu-Sn-Ti metal bond was explained with sintering process parameters atomic properties and thermodynamic analysis etc.