首页> 中文期刊> 《材料科学技术:英文版 》 >Evolution of microstructures and intermetallic compounds at bonding interface in friction stir welding of dissimilar Al/Mg alloys with/without ultrasonic assistance

Evolution of microstructures and intermetallic compounds at bonding interface in friction stir welding of dissimilar Al/Mg alloys with/without ultrasonic assistance

         

摘要

Complete understanding of the evolution behaviors of the microstructures and intermetallic compounds(IMCs)along the interface materials flow path in friction stir welding(FSW)of dissimilar Al to Mg alloys is of great significance.In this study,conventional FSW and ultrasonic vibration enhanced FSW(UVeFSW)experiments of Al/Mg alloys were performed,and the instantaneous evolution features of the interface materials around the tool were"frozen"by using the"sudden stop"and simultaneous cooling techniques.The microstructures and IMCs formation at different locations around the exit hole were observed and characterized by scanning electron microscope,energy dispersive spectrometer and transmission elec-tron microscope.It was found that before the materials started to deposit near the back of the tool,“IMC+Mg+IMC+Al”multilayer microstructure and simple IMC layer with(β+γ)sequentially emerged on the Al/Mg interface.With the application of ultrasonic vibration,the multi-layered interface structure only appeared at the middle stage of materials flow around the pin,and ultrasonic vibration just began to play a suppression role on the growth of two sub-layers IMC at a position where the materials deposit.With assistance of ultrasonic vibration in UVeFSW,the tool drove a larger volume of Mg alloy to move toward the retreating side,and the final IMCs thickness was thinner than that in FSW.

著录项

相似文献

  • 中文文献
  • 外文文献
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号