Thegrowth characteristics of intermetallic compound (IMC) at the interface of Al(4A60)−steel(08Al) clad strip applied for air cooling at power station with different simulated brazing processes were investigated by metallographic microscopy, scanning electron microscopy, X-ray diffractometry. And the bonding properties of clad strip were studied through tensile peeling test. The results show that the critical forming temperature of IMC is 605−615℃ when the holding time is less than 20 min, and the composition of the IMC is Fe 2Al5. As the holding time increases, the growth of IMC meets the parabolic relationship. The growth constant k is 0.69×10−12 m2/s while the annealing temperature is 615℃. When the IMC thickness is less than 12 µm, the interface bonding strength of clad strip still remains well (>45 MPa). As the thickness of IMC increases, the bonding strength of the interface decreases rapidly. When the thickness of IMC is 25−43 µm, the bonding strength of the interface decreases to 10−20 MPa. When the thickness of IMC is 54−68 µm, the bonding strength of the interface is only 5−10 MPa.%采用金相显微镜、扫描电镜和X射线衍射仪，研究电站空冷用铝(4A60)−钢(08Al)复合带材在不同模拟钎焊工艺下界面化合物的生长特性。通过界面剥离实验，分析不同钎焊条件下复合带材结合性能的变化规律。结果表明：在钎焊保温时间20 min内，铝(4A60)−钢(08Al)复合带材生成界面金属间化合物(IMC)的临界温度范围为605~615℃，界面相主要成分为Fe 2 Al 5。界面金属间化合物厚度随保温时间的增长满足抛物线规律，在615℃时，生长常数k为0.69×10−12 m2/s。界面金属间化合物厚度在12µm以下时，复合带材仍保持良好的界面结合强度(大于45 MPa)。随着金属间化合物厚度继续增加，界面结合强度显著下降，当金属间化合物厚度为25~43µm时，结合强度降至10~20 MPa；当金属间化合物厚度为54~68µm时，界面结合强度只有5~10 MPa。
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