交联聚合物本征导热性能研究进展

摘要

综述了近年来本征导热交联聚合物的最新研究进展,分析了交联聚合物的声子导热机理及影响因素,重点探讨了在交联聚合物内构筑微尺度有序结构的3类方法:引入类晶结构预聚物、固化剂,液晶和介晶单元,以及通过选择交联剂结构来调控相邻分子链间非共价键作用力,建立利于声子传递的导热通道.最后提出了本征导热交联聚合物的发展方向.%This paper reviewed the latest research progress in heat-conductive cross-linking polymers and analyzed the phonon heat transfer mechanism and influencing factors on heat conduction of intrinsic polymers.Furthermore,the paper mainly discussed the methodology for enhancing the thermal conductivity of cross-linked polymers,which included the introduction of the prepolymer and curing agent with ordered structure units,the incorporation of liquid crystal or meso-genic units into the cured networks to form local microscopically-ordered structures,and the construction of heat conductive pathways through nonbonding inter-chain interactions by choosing proper crosslinker for the networks.Finally,the further direction in development of the intrinsic heatconductive cross-linked polymers was mentioned.