非等温DSC研究低共熔点芳胺/环氧E44固化动力学

摘要

The curing reaction kinetics of an eutectic aromatic amine/epoxy resin E44 system is investigated by nonisothermal DSC method. The kinetic parameters of this system are calculated by Kissinger, Ozawa and Crane e-quations; the apparent activation energy E= 49.2 kJ/mol(by Kissinger and Ozawa methods) , the reaction order n = 0. 95(by Crane equation) , the frequent factor A-2. 60×l05 s-1(by Kissinger method). The kinetic model of the curing process based on n order reaction equation is established, which is used for modeling the curing reaction characteristics. The curing conditions are defined as follow; 50t/2 h, 140t/2 h, post-curing 200℃/2 h. The curing behavior of the system is hardly affected by the change in the amount of the filler boron carbide ( B4 C ) added into the eutectic aromatic amine/epoxy resin E44 system.%采用非等温DSC法对低共熔点芳胺固化剂/环氧E44体系进行了固化动力学研究,通过Kissinger、Ozawa和Crane方法获得了该体系固化动力学参数:表观活化能E=49.2 kJ/mol,固化反应级数n=0.95,频率因子A=2.60×105s-1.固化动力学方程可表示为:((dα)/(dt))=2.60×105(1-α)0.95exp(-(49200/RT)).初步确定了该体系固化工艺条件为50℃/2 h、140℃/2 h、200℃后处理2h.填料B4C加入量对该体系固化过程的DSC曲线几乎无影响.