进行了置氢TC4钛合金的真空扩散连接及接头力学性能测试,利用光学金相(OM)、扫描电镜( SEM)分析手段研究了连接工艺参数对界面孔洞弥合的影响以及拉伸断口特点.结果表明:氢元素能够显著提高扩散连接界面孔洞弥合率；随着连接温度的升高、连接时间的延长以及连接压力的增大,界面孔洞逐渐减少；合适的置氢扩散连接工艺参数为:焊接温度775C,保温时间60min,焊接压力4MPa,置氢质量分数0.4％；接头室温拉伸强度达1017MPa,为等条件下母材强度的96％,断口兼具韧窝及撕裂棱特征.%The diffusion bonding of hydroge-nated TC4 alloy and the mechanic property test are carried out. The diffusion hole close-up ratio and fracture are investigated by means of optical metallographic microscope and scanning electron microscope. The results show that the hydrogen is beneficial to increasing the holes close-up ratio of TC4 diffusion bonding. With the diffusion bonding parameters increasing the diffusion holes decrease gradually. When bonded at 775℃ for 60min under a pressure of 4MPa, the diffusion holes disappear and the tensile strength of the joint is up to 1017MPa, which reaches 96% that of the base metal, and the fracture face exhibits tear-ridge and dimple pattern.
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