Macromodeling and simulation of linear components characterized by measured parameters.

摘要

Recently, microelectronics designs have reached extremely high operating frequencies as well as very small die and package sizes. This has made signal integrity an important bottleneck in the design process, and resulted in the inclusion of signal integrity simulation in the computer aided design flow. However, such simulations are often difficult because in many cases it is impossible to derive analytical models for certain passive elements, and the only available data are frequency-domain measurements or full-wave simulations. Furthermore, at such high frequencies these components are distributed in nature and require a large number of poles to be properly characterized. Simple lumped equivalent circuits are therefore difficult to obtain, and more systematic approaches are required. In this thesis we study the Vector Fitting techniques for obtaining such equivalent model and propose a more streamlined approach for preserving passivity while maintaining accuracy.