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Influence of nitrogen incorporation on the electronic properties of dilute nitride (indium)gallium arsenic nitride alloys.

机译:氮的掺入对稀氮化物(铟)镓砷化砷合金的电子性能的影响。

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摘要

(In)GaAsN alloys with a few percent N have shown significant promise for a wide range of applications. However, N incorporation degrades the optical and electronic properties of GaAsN, which has not been sufficiently accounted for by any theory. Thus, the objective of this dissertation is to develop an understanding of the formation of N-related extrinsic and intrinsic point defects and their influence on the electronic properties of InGaAsN alloys.;The presence of extrinsic N-related point defect, Si-N complexes, is suggested by a decrease in carrier concentration, n, with increasing N-composition in GaAsN:Si films but not modulation-doped heterostructures. For GaAsN:Te (GaAsN:Si), n increases substantially (minimally) with rapid thermal annealing (RTA) T, suggesting a competition between annealing-induced Si-N complex formation and a reduced concentration of N-related traps. Since Si-N complex formation is enhanced for GaAsN:Si growth with the (2 x 4) reconstruction, which has limited group V sites for As-N exchange, the (Si-N)As interstitial pair is identified as the dominant Si-N complex. Finally, using modulation-doped GaAs(N)/AlGaAs heterostructures, neutral scatterers, likely N interstitials, were identified as the dominant source of carrier scattering in the absence of Si-N complexes.;For intrinsic N-related defects, we compared GaAsN films before and after RTA. For as-grown GaAs1-xNx films, an onset of a metal-insulator transition (MIT) at a much higher n than that in GaAs is observed, accompanied by a shrinkage of the electron Bohr radius, aB, with increasing x. In addition, the T-dependence of n for T>150K suggests the presence of a N-induced electron trapping level below the GaAsN CB edge, accompanied by a persistent photoconductivity (PPC) effect. After RTA, a transition occurs in the low T transport mechanism from hopping to extended band conduction, the T-dependence of n is suppressed, and the PPC effect vanishes. Interestingly, NRA reveals an RTA-induced decrease in N interstitial fraction, f int; the corresponding signatures for the reduction in fint are also identified in Raman spectra. Thus, it is likely that N interstitials are responsible for the MIT, the a B shrinkage, the N-induced trapping level, and the PPC effect. Thus, N interstitials are the dominant form of intrinsic N defects in GaAsN.
机译:具有百分之几的N的(In)GaAsN合金已显示出广泛应用的巨大希望。然而,氮的掺入会降低GaAsN的光学和电子性能,这在任何理论上都没有充分考虑。因此,本论文的目的是发展对N相关的本征和本征点缺陷的形成及其对InGaAsN合金电子性能的影响的认识。通过在GaAsN:Si膜中增加N的组成而降低载流子浓度n提出了建议,但没有掺杂调制的异质结构。对于GaAsN:Te(GaAsN:Si),n随快速热退火(RTA)T显着(最小)增加,这表明退火引起的Si-N络合物形成与N相关陷阱浓度降低之间存在竞争。由于通过(2 x 4)重建增强了GaAsN:Si生长的Si-N络合物的形成,该重建具有有限的V组用于As-N交换的位置,(Si-N)As间隙对被确定为主要的N复合体。最后,使用调制掺杂的GaAs(N)/ AlGaAs异质结构,在没有Si-N络合物的情况下,中性散射体(可能为N间隙)被确定为载流子散射的主要来源。对于固有的N相关缺陷,我们比较了GaAsN RTA之前和之后的电影。对于生长的GaAs1-xNx薄膜,观察到金属-绝缘体转变(MIT)的起始温度远高于GaAs中的n,同时伴随着x的增加,电子玻尔半径aB减小。另外,对于T> 150K,n的T依赖关系表明在GaAsN CB边缘以下存在N诱导的电子俘获能级,并伴有持续的光电导(PPC)效应。在RTA之后,低T传输机制发生了从跳变到扩展带导通的转变,n的T相关性受到抑制,PPC效应消失了。有趣的是,NRA揭示了RTA诱导的N间质分数f int的降低;在拉曼光谱中还可以识别出减少软化的相应特征。因此,很可能是由N个间隙材料引起的MIT,AB收缩,N诱导的陷阱能级和PPC效应。因此,N间隙是GaAsN中固有N缺陷的主要形式。

著录项

  • 作者

    Jin, Yu.;

  • 作者单位

    University of Michigan.;

  • 授予单位 University of Michigan.;
  • 学科 Physics Condensed Matter.
  • 学位 Ph.D.
  • 年度 2010
  • 页码 174 p.
  • 总页数 174
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

  • 入库时间 2022-08-17 11:36:50

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