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A physics-based compact model for thermoelectric devices.

机译:基于物理的热电设备紧凑模型。

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摘要

Thermoelectric devices have a wide variety of potential applications including as coolers, temperature regulators, power generators, and energy harvesters. During the past decade or so, new thermoelectric materials have been an active area of research. As a result, several new high figure of merit (zT) materials have been identified, but practical devices using these new materials have not yet been reported. A physics-based compact model could be used to simulate a thermoelectric devices within a full system using SPICE-compatible circuit simulators. If such a model accepts measured or simulated material parameters, it would be useful in exploring the system level applications of new materials. In this thesis, the ground work for such a compact model is developed and tested. I begin with a discussion of thermoelectric transport theory within the Landauer formalism. The Landauer formalism is used as the basis of the tool LanTraP, which uses full band descriptions to calculate the distribution of modes and thermoelectric transport parameters, which can serve as the input to a compact model. Next, an equivalent circuit model is presented, explained, and tested using a simple Bi2Te 3 thermoelectric leg. The equivalent circuit is shown to perform well under a variety of DC, transient, and AC small signal operating conditions. With the equivalent circuit it is easy to determine the maximum cold side temperature drop, the maximum cold side heat absorbed, the temperature profile within the leg, the temperature response to a pulsed current, and impedance over a range of frequencies. Finally, SentaurusRTM, a computer program that solves the thermoelectric transport equations numerically, is used to compare and benchmark some of the results of the equivalent circuit when considering Si as the thermoelectric material. The equivalent circuit and SentaurusRTM simulations produce similar results in DC and transient cases, but in the AC small signal case the two simulations produce slight differences. The results of this work establishes a baseline compact model for thermoelectric devices whose accuracy and capabilities can be extended.
机译:热电设备具有广泛的潜在应用,包括用作冷却器,温度调节器,发电机和能量收集器。在过去的十年左右的时间里,新型热电材料一直是研究的活跃领域。结果,已经确定了几种新的高品质因数(zT)材料,但是尚未报道使用这些新材料的实用设备。基于物理的紧凑模型可用于使用SPICE兼容电路模拟器在整个系统中模拟热电设备。如果这样的模型接受测量或模拟的材料参数,则在探索新材料在系统级的应用中将很有用。在本文中,开发并测试了这种紧凑模型的基础工作。我首先在Landauer形式主义中讨论热电输运理论。 Landauer形式主义用作LanTraP工具的基础,该工具使用全波段描述来计算模式分布和热电输运参数,可以作为紧凑模型的输入。接下来,使用简单的Bi2Te 3热电桥腿介绍,解释和测试了等效电路模型。该等效电路在各种直流,瞬态和交流小信号工作条件下均表现良好。利用等效电路,很容易确定最大冷侧温度下降,最大冷侧吸收热量,支脚内的温度曲线,对脉冲电流的温度响应以及在一定频率范围内的阻抗。最后,当将Si视为热电材料时,SentaurusRTM是一种计算机程序,可以通过数值方式求解热电输运方程,用于比较和确定等效电路的某些结果。等效电路和SentaurusRTM模拟在直流和瞬态情况下产生相似的结果,但在交流小信号情况下,两种模拟产生细微差异。这项工作的结果为热电设备建立了基线紧凑模型,其精度和功能可以扩展。

著录项

  • 作者

    Conrad, Kyle.;

  • 作者单位

    Purdue University.;

  • 授予单位 Purdue University.;
  • 学科 Electrical engineering.
  • 学位 M.S.E.C.E.
  • 年度 2015
  • 页码 138 p.
  • 总页数 138
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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