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Joining of aluminum-based particulate-reinforced metal matrix composites.

机译:铝基颗粒增强金属基复合材料的连接。

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摘要

In this study, 25 Vol% SiCp/6061 Al metal matrix composite (MMC) materials were joined by the transient liquid phase diffusion bonding process using a Gleeble 1500 system. In order to understand the effects of the bonding thermo-mechanical cycle on the mechanical and metallurgical properties of the base material, thermal and thermo-mechanical simulation studies were performed with a regular heat treatment furnace and the Gleeble 1500 system. Thermal simulation conditions included temperatures ranging from 500 to 590{dollar}spcirc{dollar}C and times from 5 to 9 minutes. Thermo-mechanical simulation conditions ranged temperatures from 540 to 580{dollar}spcirc{dollar}C, times from 5 to 60 minutes and pressures from 350 to 900 psi, with resulting deformation at the interface from 1.8 to 11.9%. Degradation in base material mechanical properties (microhardness and strength evaluation) with time, temperature and loading was observed. The simulated bond structures were characterized with optical and scanning-electron microscopy (SEM) and bonding temperatures and times were selected.; TLP bonds in MMC were obtained with a 0.001{dollar}sp{lcub}primeprime{rcub}{dollar} silver interlayer at temperatures ranging from 570 to 580{dollar}spcirc{dollar}C and times from 5 to 30 minutes. Joints characterized with optical microscopy and SEM revealed the occurrence of voids at the interface. Electron microprobe analysis (EPMA) confirmed the silver gradients near the interface. Evaluation of a bond with a 0.005{dollar}sp{lcub}primeprime{rcub}{dollar} interlayer by optical micrography and EPMA identified the chemistry of lamellar solidification products. The tensile strength of the joint bonded at 579{dollar}spcirc{dollar}C for 20 minutes, at 12.9 ksi, yielded a joint efficiency of 29.86% based on the properties of the thermo-mechanically simulated and heat treated sample (575{dollar}spcirc{dollar}C, 30 minutes). SEM fractographs indicated the occurrence of partially dimpled fracture with limited microscopic ductility and particulate fracture. Finally, the process parameters responsible for an improvement in the mechanical properties were identified.
机译:在这项研究中,使用Gleeble 1500系统通过瞬态液相扩散键合工艺将25 Vol%SiCp / 6061 Al金属基复合材料(MMC)材料连接起来。为了了解粘合热机械循环对基础材料的机械和冶金性能的影响,使用常规热处理炉和Gleeble 1500系统进行了热和热机械模拟研究。热模拟条件包括温度范围为500至590℃,时间为5至9分钟。热机械模拟条件的温度范围为540至580℃,时间为5至60分钟,压力为350至900 psi,界面处的变形为1.8至11.9%。观察到随着时间,温度和载荷的降低,基材的机械性能(显微硬度和强度评估)下降。用光学和扫描电子显微镜(SEM)对模拟的键结构进行表征,并选择键合温度和时间。 MMC中的TLP键是在0.001至580℃的温度和5至30分钟的时间范围内,用0.001 sp.lcprimeprime rcub}美元的银中间层获得的。用光学显微镜和SEM表征的接头显示在界面处出现空隙。电子探针分析(EPMA)确认了界面附近的银梯度。通过光学显微术和EPMA对具有0.005 {sp} lc {lcub} primeprime {rcub} {dollar}中间层的键进行评估,EPMA确定了层状固化产物的化学性质。根据热机械模拟和热处理后的样品(575 {美元)的特性,在12.9 ksi下在579spcirc {dollar} C下粘合20分钟的接头的抗拉强度得出的联合效率为29.86%。 } spcirc {dollar} C,30分钟)。 SEM断口扫描仪显示发生了部分凹痕的断裂,微观延展性和颗粒断裂受到限制。最后,确定了有助于改善机械性能的工艺参数。

著录项

  • 作者

    Kolli, Sudhakar.;

  • 作者单位

    The Ohio State University.;

  • 授予单位 The Ohio State University.;
  • 学科 Engineering Metallurgy.; Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 1990
  • 页码 287 p.
  • 总页数 287
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 冶金工业;工程材料学;
  • 关键词

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