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Optimization techniques for VLSI process modeling and TCAD in semiconductor manufacturing.

机译:半导体制造中VLSI工艺建模和TCAD的优化技术。

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摘要

In the field of semiconductor manufacturing, the paradigm shift from lambda scaling design rules, to pattern dependent design rules, caused by sub-quarter micron critical dimensions, requires the introduction of sophisticated TCAD and simulation techniques capable of modeling several heterogeneous fabrication processes and optimizing the overall system. The novel optimization technique of Process Metamodeling has been developed and successfully implemented, by constructing neural-network based models of given physical models, representing semiconductor fabrication processes. This second level of abstraction provides both a direct metamodel of a process, which allows the computation of one or several process responses with a speed-up of two orders of magnitude, with respect to standard simulation, and a (totally or partially) inverted process metamodel, which identifies the mapping between process responses and selected process control parameters. This mapping is used in the solution of the parameters extraction (or model calibration) problem. We have demonstrated that, by using a carefully chosen metamodel, it is possible to determine values for unknown (or difficult to estimate) model parameters, which bring a simulated response to overlap, almost identically, with its corresponding experimental one. Several case studies are presented for both direct and inverse metamodels. A complete optimization is also performed for a PEB process for chemically amplified resist. Applications are in the field of Lithography, because of its inherent criticality, with respect to the whole semiconductor manufacturing chain. A novel PEB 3D simulator (which includes photoacid-loss, diffusion and deprotection reactions) was developed as a benchmarking software. Finally, comparisons with other optimization techniques (simulated annealing, genetic algorithms) show that fewer simulation runs are required by process metamodeling for the solution of both optimization and parameters extraction problems.
机译:在半导体制造领域,由于亚四分之一微米的临界尺寸,范式从lambda缩放设计规则向依赖于图案的设计规则转变,要求引入复杂的TCAD和仿真技术,这些技术能够对几种异质制造工艺进行建模并优化整体系统。通过构造代表半导体制造工艺的给定物理模型的基于神经网络的模型,已经开发并成功实现了工艺元模型化的新颖优化技术。第二层抽象提供了过程的直接元模型(相对于标准模拟,该模型允许以两个数量级的速度计算一个或多个过程响应)和(全部或部分)倒置过程元模型,它标识过程响应与所选过程控制参数之间的映射。此映射用于解决参数提取(或模型校准)问题。我们已经证明,通过使用精心选择的元模型,可以确定未知(或难以估计)模型参数的值,这些参数会使模拟响应与其相应的实验响应几乎完全相同。提出了一些针对直接和反向元模型的案例研究。还对化学放大的抗蚀剂的PEB工艺进行了完全优化。由于其固有的重要性,因此在整个半导体制造链中的应用都在光刻领域。开发了新型的PEB 3D仿真器(包括光酸损失,扩散和脱保护反应)作为基准测试软件。最后,与其他优化技术(模拟退火,遗传算法)的比较表明,通过过程元模型来解决优化和参数提取问题所需的模拟运行次数更少。

著录项

  • 作者

    Capodieci, Luigi.;

  • 作者单位

    The University of Wisconsin - Madison.;

  • 授予单位 The University of Wisconsin - Madison.;
  • 学科 Electrical engineering.;Operations research.;Computer science.
  • 学位 Ph.D.
  • 年度 1997
  • 页码 186 p.
  • 总页数 186
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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