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Measurement and control of organic contaminants in ultrapure water systems.

机译:超纯水系统中有机污染物的测量和控制。

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摘要

In semiconductor manufacturing, silicon wafers are repeatedly cleaned with ultrapure water. As the wafer size increases and the line width shrinks, the ultrapure water consumption continues to increase. More stringent requirements are placed on the rinse water specification. Improvements in water purification must be brought forth to meet the needs.;The total concentration of all inorganic ions subject to measurement in ultrapure water is often below 1 ppb. By comparison, the concentration of organic contaminants is often an order of magnitude higher. Organic contaminants in rinse water cause defects and decrease device yield. Removing organic contaminants is therefore very important.;The present study focuses on the mechanisms and kinetics of various organic impurity removal processes, particularly, of chemical oxidation processes.;A novel photocatalytic filter is developed that incorporates the feature of filtration and chemical oxidation. Organic contaminants are separated through entrapment and adsorption. They are destroyed through photocatalytic oxidation.;The oxidation of organic contaminants using UV irradiation, ozone or a combination of UV and ozone is studied. For most model contaminants, UV oxidation is not a first order reaction in terms of the contaminant concentration. UV/ozone oxidation removes organic contaminants synergistically.;The removal of dissolved gases and VOCs using a unique membrane degasification technology is also investigated.;Another important aspect is the qualitative and quantitative analysis of impurities. In this work, organic impurities are measured using a combination of a total oxidizable organic monitor and a non-volatile residue monitor. A new method is studied using an attenuated total reflection - Fourier transform infrared spectrometer. It has the advantage of detecting the most harmful organic contaminants which adsorb on a silicon wafer.;Based on the fundamental information obtained on each process unit, an overall process simulator is developed. Modeling an ultrapure water system will reveal its response characteristics to a possible contamination challenge. This makes it possible to optimize the system configuration and operation. The feasibility of rinse water recycling/reclamation is also studied.
机译:在半导体制造中,硅晶片要用超纯水反复清洗。随着晶片尺寸的增加和线宽的缩小,超纯水消耗量持续增加。对冲洗水规格有更严格的要求。为了满足需要,必须对水的净化进行改进。在超纯水中要测量的所有无机离子的总浓度通常低于1 ppb。相比之下,有机污染物的浓度通常要高一个数量级。冲洗水中的有机污染物会导致缺陷并降低设备良率。因此,去除有机污染物非常重要。本研究的重点是各种有机杂质去除过程的机理和动力学,特别是化学氧化过程。研制了一种具有过滤和化学氧化功能的新型光催化过滤器。有机污染物通过截留和吸附分离。通过光催化氧化将其破坏。研究了使用紫外线辐射,臭氧或紫外线和臭氧的组合对有机污染物的氧化。对于大多数模型污染物,就污染物浓度而言,紫外线氧化不是一阶反应。 UV /臭氧氧化可协同去除有机污染物。还研究了使用独特的膜脱气技术去除溶解气体和VOC的另一个重要方面是杂质的定性和定量分析。在这项工作中,使用总可氧化有机监测器和非易失性残留监测器的组合来测量有机杂质。研究了一种使用衰减全反射的新方法-傅里叶变换红外光谱仪。它具有检测吸附在硅晶片上的最有害的有机污染物的优点。;基于在每个处理单元上获得的基本信息,开发了一个整体的过程模拟器。对超纯水系统进行建模将揭示其对可能的污染挑战的响应特性。这使得优化系统配置和操作成为可能。还研究了冲洗水再循环/再生的可行性。

著录项

  • 作者

    Chen, Guoqing.;

  • 作者单位

    The University of Arizona.;

  • 授予单位 The University of Arizona.;
  • 学科 Engineering Chemical.;Engineering Electronics and Electrical.;Engineering Environmental.
  • 学位 Ph.D.
  • 年度 1997
  • 页码 224 p.
  • 总页数 224
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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