Integrated package, IC and system design.

摘要

Advances in semiconductor processing technologies continue to enhance the performance of individual devices. However, these performance gains cannot be translated to the system level unless several technological obstacle can be circumvented and the ever increasing interactions between system, IC and package design are well understood. In this dissertation, I present design and analysis methods that optimize system metrics by analyzing the physical limitations of IC and packaging technologies and performing optimization, partitioning across multiple domains (IC, package, and system). CAD tools (AUDiT/SPA) implementing such a design strategy will be discussed. Specific design techniques, such as transient thermal management for portable electronics, power/clock distribution and smart interconnect design, as well as issues related to EMI management in compact wireless units will also be presented. It will be demonstrated that by concurrently considering package, IC and system design domains, many new design opportunities arise. Higher performance, as well as more balanced electronic systems can thus be designed.