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Advanced processes and characterization of amorphous silicon thin film transistors.

机译:非晶硅薄膜晶体管的先进工艺和特性。

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摘要

In this work, an advanced thin film optical characterization technique is first developed to overcome the distortion in conventional spectra. This technique utilizes a Brewster angle incidence of p-polarized probe beam to achieve an interference fringe-free characterization. For vibrational absorption spectroscopy, an ideal spectrum is obtained if a straight and horizontal baseline is observed. While for optical transmission spectroscopy, the optimal spectrum is indicated by the matching of optical bandgaps defined at absorption coefficient of 104 and defined by the linear extrapolation.; To increase the throughput of TFT manufacturing, the a-Si:H plasma-enhanced chemical vapor deposition (PECVD) rate is enhanced by the process optimizations at both standard (13.56 MHz) and high frequencies (40 MHz) excitations. It is shown in this study that a-Si:H deposition rate was successfully increased from conventional 15 run/min to as high as 375 nm/min with an acceptable device characteristics. The increase alone should result in more than 20 times reduction of TFT process time.; The evaluation of material properties indicates a general adverse trend of a-Si:H quality to its deposition rate. In particular, the mono-hydride density decreases with the increase of deposition rate. Consequently, in a-Si:H, the disorder is increased, and flattening of valence and conduction bandtails is resulted. For example, the Urbach edge of a-Si:H changes from 50 ± 5 to 87 ± 5 meV when the deposition rate varies from 14 to 120 nm/min.; The a-Si:H deposition rate influence on TFTs' electrical performance is mainly manifested in TFT's electron field-effect mobility and threshold voltage, which generally decreases and increases with the a-Si:H deposition rate, respectively. The field-effect mobilities and threshold voltage in saturation region of TFT with W/L ratio of 80/100 change from the 1.14 ± 0.07 to 0.27 ± 0.02 cm2/Vs and from 3.1 ± 0.2 to 6.1 ± 0.2 V, respectively, while a-Si:H deposition rate varies from 14 to 120 nm/min.; On the other hand, TFT's long-term instability in terms of threshold voltage shift does not show significant a-Si:H deposition rate dependence. It is suggested in this study that TFT's instability be mainly affected by the quality of a-SiNx:H and the interface of a-Si:H and a-SiNx:H, while it is not sensitive to a-Si:H bulk quality.
机译:在这项工作中,首先开发了一种先进的薄膜光学表征技术来克服常规光谱中的畸变。该技术利用 p 偏振探头光束的布鲁斯特角入射来实现无干涉条纹的表征。对于振动吸收光谱法,如果观察到直线和水平基线,则可获得理想光谱。对于光透射光谱,最佳光谱由吸收系数为10 4 定义并由线性外推定义的光学带隙匹配表示。为了提高TFT制造的生产率,通过在标准(13.56 MHz)和高频(40 MHz)上进行工艺优化,提高了 a -Si:H等离子体增强化学气相沉积(PECVD)速率)激励。这项研究表明, a -Si:H沉积速率已成功从常规的15次/分钟提高到高达375 nm / min,并且具有可接受的器件特性。仅仅增加就可以使TFT处理时间减少20倍以上。材料性能评估表明, a -Si:H质量对其沉积速率普遍存在不利趋势。特别地,单氢化物密度随着沉积速率的增加而降低。因此,在 a -Si:H中,该疾病增加,并且导致价键和导带的扁平化。例如,当沉积速率从14 nm / min变为120 nm / min时, a -Si:H的Urbach边缘从50±5到87±5 meV。 a -Si:H沉积速率对TFT的电性能的影响主要表现在TFT的电子场效应迁移率和阈值电压,通常随 a 的增加而降低。 -Si:H沉积速率分别。 W / L比为80/100的TFT饱和区中的场效应迁移率和阈值电压从1.14±0.07变为0.27±0.02 cm 2 / Vs,从3.1±0.2变为6.1分别为±0.2 V,而- -Si:H沉积速率在14至120 nm / min之间变化;另一方面,就阈值电压漂移而言,TFT的长期不稳定性并未显示出显着的 a -Si:H沉积速率依赖性。这项研究表明,TFT的不稳定性主要受 a -SiN x :H的质量和 a -Si界面的影响。 :H和 a -SiN x :H,但对 a -Si:H整体质量不敏感。

著录项

  • 作者

    Li, Tong.;

  • 作者单位

    University of Michigan.;

  • 授予单位 University of Michigan.;
  • 学科 Engineering Electronics and Electrical.; Physics Condensed Matter.; Physics Optics.
  • 学位 Ph.D.
  • 年度 2000
  • 页码 142 p.
  • 总页数 142
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;光学;
  • 关键词

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