首页> 外文学位 >Modeling of RF power transistors for power amplifier design.
【24h】

Modeling of RF power transistors for power amplifier design.

机译:用于功率放大器设计的RF功率晶体管建模。

获取原文
获取原文并翻译 | 示例

摘要

Presented is a large/small signal, non-quasi-static, charge conserving, MOSFET modeling technique suitable for DC and high frequency circuit design. The technique is theoretically developed for a SOI MOSFET on a physical device simulator and is applied to a LDMOSFET device.; A DC electro-thermal model is developed by using a single thermal resistance to map the thermal response of the device. An automated novel approach to measuring iso-thermal IVs and microwave scattering parameters is discussed as an alternative to pulsed IV, pulsed RF measurements. The iso-thermal IV is used by the device in establishing its DC point of operation. The iso-thermal s-parameters are used to extract temperature dependent small signal model parameters. A novel extraction technique utilizing analytical expressions is presented. The extraction procedure yields a continuum of solutions as a function of the source parasitic resistances, Rs. A multi-bias analysis is used to determine the final Rs. gm, C11, and C 21 are found to vary with temperature while gd, C12, and C22 are found to exhibit much less temperature variation.; Hot and cold pulsed IVs are compared with iso-thermal IVs. Their associated transconductances are compared to RF gm, obtained from microwave measurements. The existence of low frequency dispersion in LDMOSFETs, in spite of the p+ sinker, is demonstrated. It is verified that globally over temperature, the iso-thermal IVs still agree the best with gm,RF.; A temperature dependent large signal model is generated by integrating temperature dependent gm,RF and g d,RF. 3D Tensor Product B-Splines (TPS) utilizing an optimum knot placement scheme, are used to represent the IV and it's associate derivatives. Optimum knot placement is necessary to handle areas of large derivative variation in data. Optimized TPS is used to represent the capacitances and extract the gate and drain charges.; The large signal model is implemented in ADS as a user defined model. In the process of doing so, a number of bugs in ADS were reported to Agilent. Harmonic balance simulations are conducted on a power amplifier and amplifier matrices such as fundamental, second and third harmonic power, drain current, temperature and two tone intermodulation distortion predicted by the model are compared to measured results. The impact on the model of temperature dependent drain and gate charge is investigated. Higher temperature is found to introduce more profound sweet spots. The model, in spite of its simplifications, is found to compare well with the existing MET model, which is based on pulsed IV and pulsed RF. For two tone IMD simulations, the developed model is found to out perform the MET model.
机译:提出了一种适用于直流和高频电路设计的大/小信号,非准静态,节省电荷的MOSFET建模技术。该技术在理论上是为物理设备模拟器上的SOI MOSFET开发的,并应用于LDMOSFET器件。通过使用单个热阻来绘制设备的热响应来开发DC电热模型。讨论了一种自动测量等温IV和微波散射参数的新颖方法,以替代脉冲IV,脉冲RF测量。设备使用等温IV建立其直流工作点。等温s参数用于提取温度相关的小信号模型参数。提出了一种利用解析表达式的新颖提取技术。提取程序会根据源寄生电阻Rs产生连续的解。多重偏置分析用于确定最终Rs。发现gm,C11和C 21随温度变化,而发现gd,C12和C22的温度变化小得多。将热和冷脉冲IV与等温IV进行比较。将它们相关的跨导与从微波测量获得的RF gm进行比较。尽管有p +沉降片,但仍证明了LDMOSFET中存在低频色散。经验证,在整个温度范围内,等温IV仍与gm,RF最佳。通过对温度相关的gm,RF和g d,RF进行积分来生成温度相关的大信号模型。利用最佳结放置方案的3D张量积B样条线(TPS)用于表示IV及其关联派生。最佳的结位置对于处理数据中较大的导数变化区域是必要的。优化的TPS用于表示电容并提取栅极和漏极电荷。大信号模型在ADS中作为用户定义的模型实现。在这样做的过程中,已向安捷伦报告了ADS中的许多错误。在功率放大器上进行谐波平衡仿真,并将该模型预测的放大器矩阵(如基波,二次谐波和三次谐波功率,漏极电流,温度和两个音调互调失真)与测量结果进行比较。研究了对温度依赖的漏极和栅极电荷模型的影响。发现较高的温度引入了更深的甜点。尽管简化了该模型,但发现该模型可以与基于脉冲IV和脉冲RF的现有MET模型进行比较。对于两个音调的IMD模拟,发现开发的模型优于MET模型。

著录项

  • 作者

    Akhtar, Siraj.;

  • 作者单位

    The Ohio State University.;

  • 授予单位 The Ohio State University.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2000
  • 页码 134 p.
  • 总页数 134
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号