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Characterization of HgCdTe and Related Materials For Third Generation Infrared Detectors

机译:用于第三代红外探测器的HgCdTe及其相关材料的表征

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摘要

Hg1-xCdxTe (MCT) has historically been the primary material used for infrared detectors. Recently, alternative substrates for MCT growth such as Si, as well as alternative infrared materials such as Hg1-xCdxSe, have been explored. This dissertation involves characterization of Hg-based infrared materials for third generation infrared detectors using a wide range of transmission electron microscopy (TEM) techniques.;A microstructural study on HgCdTe/CdTe heterostructures grown by MBE on Si (211) substrates showed a thin ZnTe layer grown between CdTe and Si to mediate the large lattice mismatch of 19.5%. Observations showed large dislocation densities at the CdTe/ZnTe/Si (211) interfaces, which dropped off rapidly away from the interface. Growth of a thin HgTe buffer layer between HgCdTe and CdTe layers seemed to improve the HgCdTe layer quality by blocking some defects.;A second study investigated the correlation of etch pits and dislocations in as-grown and thermal-cycle-annealed (TCA) HgCdTe (211) films. For as-grown samples, pits with triangular and fish-eye shapes were associated with Frank partial and perfect dislocations, respectively. Skew pits were determined to have a more complex nature. TCA reduced the etch-pit density by 72%. Although TCA processing eliminated the fish-eye pits, dislocations reappeared in shorter segments in the TCA samples. Large pits were observed in both as-grown and TCA samples, but the nature of any defects associated with these pits in the as-grown samples is unclear.;Microstructural studies of HgCdSe revealed large dislocation density at ZnTe/Si(211) interfaces, which dropped off markedly with ZnTe thickness. Atomic-resolution STEM images showed that the large lattice mismatch at the ZnTe/Si interface was accommodated through {111}-type stacking faults. A detailed analysis showed that the stacking faults were inclined at angles of 19.5 and 90 degrees at both ZnTe/Si and HgCdSe/ZnTe interfaces. These stacking faults were associated with Shockley and Frank partial dislocations, respectively. Initial attempts to delineate individual dislocations by chemical etching revealed that while the etchants successfully attacked defective areas, many defects in close proximity to the pits were unaffected.
机译:Hg1-xCdxTe(MCT)历史上一直是用于红外探测器的主要材料。最近,已经探索了用于MCT生长的替代衬底,例如Si,以及替代红外材料,例如Hg1-xCdxSe。本论文涉及使用广泛的透射电子显微镜(TEM)技术表征用于第三代红外探测器的汞基红外材料。; MBE在Si(211)衬底上生长的HgCdTe / CdTe异质结构的微观结构研究表明,ZnTe薄在CdTe和Si之间生长的硅层介导19.5%的大晶格失配。观察结果表明CdTe / ZnTe / Si(211)界面处的位错密度大,并迅速从界面上掉落。在HgCdTe和CdTe层之间生长薄的HgTe缓冲层似乎可以通过阻止一些缺陷来改善HgCdTe层的质量。;第二项研究研究了生长和热循环退火(TCA)HgCdTe中蚀刻坑和位错的相关性(211)电影。对于生长中的样品,具有三角形和鱼眼形状的凹坑分别与弗兰克局部位错和完美位错有关。确定斜坑具有更复杂的性质。 TCA将蚀刻坑密度降低了72%。尽管TCA处理消除了鱼眼坑,但TCA样品中的位错在较短的段中再次出现。在生长和TCA样品中均观察到大的凹坑,但在生长的样品中与这些凹坑相关的任何缺陷的性质尚不清楚; HgCdSe的微结构研究表明ZnTe / Si(211)界面处的位错密度大,随ZnTe厚度的增加而明显下降。原子分辨率的STEM图像显示ZnTe / Si界面处的大晶格失配是通过{111}型堆叠缺陷来解决的。详细的分析表明,在ZnTe / Si和HgCdSe / ZnTe界面上,堆垛层错均以19.5和90度角倾斜。这些堆垛层错分别与肖克利和弗兰克局部位错有关。最初尝试通过化学刻蚀来描绘单个位错的方法表明,尽管刻蚀剂成功地侵蚀了缺陷区域,但紧邻凹坑的许多缺陷并未受到影响。

著录项

  • 作者

    Vaghayenegar, Majid.;

  • 作者单位

    Arizona State University.;

  • 授予单位 Arizona State University.;
  • 学科 Materials science.;Electrical engineering.
  • 学位 Ph.D.
  • 年度 2017
  • 页码 141 p.
  • 总页数 141
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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