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On-chip Structures for Reliable and Secure Integrated Circuits Design.

机译:可靠且安全的集成电路设计的片上结构。

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摘要

As technology scales to 65nm and below, aging, noise and variations in integrated circuits (IC) and systems have become the major challenges to semiconductor and EDA industry. As a result, the deviation between predicted IC performance using simulation tools and actual IC performance on silicon increases significantly. Furthermore, in Giga Hertze era, off-chip equipments have the problems of high cost and accuracy loss due to parasitics. Therefore, accurate and low-cost on-chip sensors are in great need. This dissertation focuses on the design of low-cost, accurate, and robust on-chip sensors, to capture various effects during circuit operation. The sensors are able to perform various measurements including, delay, IR-drop, aging, and process variations. The design of these sensors have been completed and the path-delay, IR-drop and negative bias temperature instability (NBTI) sensors have been inserted into a 55nm industrial SOC test chip. In addition, a novel low-cost delay configurable line (DCL) based sensor has been designed to perform parametric test for analog devices. The last part of this dissertation is the development of a novel sensor called physical unclonable function (PUF), which is employed to generate unique signature for IC identification and authentication purpose. Different from existing PUFs, which exploit only process variations for generating IC signature, the new PUF, called PE-PUF, takes into account both process and environmental variations for IC signature generation. This improvement magnifies chip-to-chip signature randomness and uniqueness.
机译:随着技术扩展到65nm及以下,老化,噪声以及集成电路(IC)和系统的变化已成为半导体和EDA行业的主要挑战。结果,使用仿真工具预测的IC性能与硅片上的实际IC性能之间的偏差会大大增加。此外,在吉加·赫兹时代,片外设备由于寄生效应而具有成本高和精度损失的问题。因此,非常需要精确且低成本的片上传感器。本文主要研究低成本,精确,耐用的片上传感器,以捕获电路工作期间的各种影响。传感器能够执行各种测量,包括延迟,IR下降,老化和过程变化。这些传感器的设计已经完成,并且将路径延迟,IR下降和负偏置温度不稳定性(NBTI)传感器插入了55nm工业SOC测试芯片中。另外,已经设计了一种新颖的基于低成本延迟可配置线(DCL)的传感器来对模拟设备进行参数测试。本文的最后一部分是新型传感器的开发,该传感器称为物理不可克隆功能(PUF),可用于生成用于IC识别和认证目的的唯一签名。与现有的PUF(仅利用工艺变化来生成IC签名)不同,称为PU-PUF的新PUF在生成IC签名时会同时考虑工艺和环境变化。这种改进扩大了芯片间签名的随机性和唯一性。

著录项

  • 作者

    Wang, Xiaoxiao.;

  • 作者单位

    University of Connecticut.;

  • 授予单位 University of Connecticut.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2010
  • 页码 127 p.
  • 总页数 127
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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