首页> 外文学位 >Part A. Accelerated curing of aryl-ethynyl end-capped polyimides. Part B. Catalytic pockets assembled by ion-pairing.
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Part A. Accelerated curing of aryl-ethynyl end-capped polyimides. Part B. Catalytic pockets assembled by ion-pairing.

机译:A部分:芳基-乙炔基封端的聚酰亚胺的加速固化。 B部分:通过离子对组装的催化袋。

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Part A. A series of end-cap model compounds were synthesized to determine the effect of modification of the aryl-ethynyl end-cap on the thermal curing process. Using 1H NMR and SEC, an accelerated thermal cure was discovered by replacement of the terminal phenyl group with 1-naphthyl- and 9-anthracenyl-ethynyl moiety. The acceleration (phenyl naphthyl anthracenyl) is in direct contrast to the steric bulk about the ethynyl bond (phenyl naphthyl anthracenyl). The acceleration discovered between phenyl- and naphthyl-model compounds occurs without a decrease in Ea, suggesting a difference in parameter(s) accounted for in A as the source of the acceleration. The thermal curing products of all model compounds are of approximately dimeric/trimeric structure with no higher products formed even towards complete reaction. The insoluble 2-naphthyl-analogue and the phenyl-control were studied using FTIR. The 2-naphthyl-model compound cures slightly faster, but with higher Ea, than the control phenyl-analogue. The analogous naphthyl- and anthracenyl-end-capped oligomers were synthesized and studied using DSC. The rate acceleration is also observed for the oligomers, resulting in a fast curing material. Analysis of the crystal structure and molecular mechanics of the model compounds reveals no significant differences in bond lengths or dipole moments, but a calculation of hyperpolarizability reveals an increase in the same order of the thermal cure trend (phenyl naphthyl anthracenyl). Incorporation of additional ether linkages in the backbone significantly effects the properties of the oligomers and resulting resins, but the rate acceleration using aryl-ethynyl end-caps are still observed and relatively unaffected by the backbone. Aryl-ethynyl model compounds incorporating electronic substituents were studied using SEC. An additional rate acceleration is observed by the incorporation of an electron-donating methoxy-substituent para to the ethynyl unit. The electron-withdrawing cyano-substituent has no effect. The analogous methoxy-naphthyl-ethynyl end-capped oligomer cure fits second-order kinetics best, unlike all other model compounds and oligomers studied, which demonstrate first-order kinetics. POSS monomers were incorporated into aryl-ethynyl end-capped oligomers and verified by NMR and SEC, and the resulting oligomers were found to undergo thermal cure to afford a new inorganic/organic hybrid resin. The new resins are also easily modified for fast-curing kinetics by incorporation of the new, fast-curing aryl-ethynyl end-caps.; Part B. Improved synthetic methods were used in the synthesis of 2,9-bis(aryl)- and 2,9-bis(arylethynyl)-1,10-phenanthroline ligands, including an unsymmetrical ligand. Further synthesis results in dianionic ligands for use in ion-pairing. The palladium complexes of 2,9-bis(aryl)- and 2,9-bis(arylethynyl)-1,10-phenanthroline ligands suffer from a cyclometallation reaction and a coordination shift, respectively, resulting in unsymmetrical complexes. The rhodium complexes of 2,9-bis(arylethynyl)-1,10-phenanthroline however, were found to be incredibly soluble and symmetric. Solution ion-pairing through proton transfer was accomplished and verified using 1H NMR. No enhanced optical rotations were observed between the 1:1 ion-pair and a 2:1 ion-pair control. A copper (I) complex was synthesized from the ion-paired ligand and confirmed by UV-visible spectroscopy and elemental analysis. Neutral and dicationic polymer-supported diamines were synthesized and the latter used in the formation of an ion-pair through ion-exchange. The polymer-supported ion-paired ligand was confirmed using FTIR. A resulting rhodium complex was also confirmed by FTIR and demonstrated catalytic activity in a benchmark hydrogenation reaction, in which the catalytic activity is intimately involved with the polymer-support.
机译: A部分。合成了一系列的封端模型化合物,以确定芳基-乙炔基封端的改性对热固化过程的影响。使用 1 NMR和SEC,通过用1-萘基和9-蒽基-乙炔基部分取代末端苯基发现加速的热固化。加速度(苯基<萘基<蒽基)与围绕乙炔基键的空间体积(苯基<萘基<蒽基)直接相反。在苯基和萘基模型化合物之间发现的加速发生而E a 却没有降低,这表明作为加速源的A中参数的差异。所有模型化合物的热固化产物均为近似二聚/三聚体结构,即使完全反应也不会形成更高的产物。使用FTIR研究了不溶性2-萘类似物和苯基-对照。 2-萘基型化合物的固化速度比对照苯基类似物快一些,但E a 更高。使用DSC合成并研究了类似的萘基和蒽基端基封端的低聚物。还观察到低聚物的速率加速,导致快速固化的材料。对模型化合物的晶体结构和分子力学分析表明,键长或偶极矩无明显差异,但超极化性的计算表明,热固化趋势相同的增加(苯基<萘基<蒽基)。在主链中并入其他醚键会显着影响低聚物和所得树脂的性能,但仍观察到使用芳基-乙炔基封端的速率加速,并且相对不受主链的影响。使用SEC研究了包含电子取代基的芳基-乙炔基模型化合物。通过将给电子的甲氧基取代基对乙炔基掺入可以观察到另外的速率加速。吸电子的氰基取代基没有作用。类似的甲氧基-萘基-乙炔基封端的低聚物固化最适合二阶动力学,这与研究的所有其他模型化合物和低聚物均表现出一阶动力学不同。将POSS单体掺入芳基-乙炔基封端的低聚物中,并通过NMR和SEC进行验证,发现所得的低聚物经过热固化,得到了一种新型的无机/有机杂化树脂。通过掺入新的快速固化的芳基-乙炔基封端,还可以轻松地对新型树脂进行改性,以实现快速固化的动力学。 B部分。改进的合成方法用于合成2,9-双(芳基)-和2,9-双(芳基乙炔基)-1,10-菲咯啉配体,包括不对称配体。进一步的合成产生了用于离子配对的双阴离子配体。 2,9-双(芳基)-和2,9-双(芳乙炔基)-1,10-菲咯啉配体的钯配合物分别遭受环金属化反应和配位移位,从而导致不对称配合物。然而,发现2,9-双(芳基乙炔基)-1,10-菲咯啉的铑配合物非常难以溶解且对称。通过质子转移完成溶液离子配对并使用 1 H NMR进行了验证。在1:1离子对和2:1离子对对照之间未观察到增强的旋光度。由离子配对的配体合成铜(I)配合物,并通过紫外可见光谱法和元素分析进行​​了确认。合成了中性和阳离子聚合物负载的二胺,后者用于通过离子交换形成离子对。使用FTIR确认了聚合物负载的离子对配体。 FTIR也证实了所得的铑配合物,并在基准氢化反应中证明了催化活性,其中催化活性与聚合物-载体密切相关。

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