Modeling multi-layer via structure using PEEC method.

摘要

In this dissertation, a new integral equation formulation for via structures is developed for the capacitance extraction between vias and planes. The proposed method can be used to calculate the shared-antipad via structure which is widely used in high-speed differential signal interconnects. In addition, we use the image theory to handle inhomogeneous media. Further, a new technique is given to reduce computational resources for via-to-plane structures based on properties of the matrix coefficient. The extracted capacitance is also incorporated into the physics-based circuit model to characterize the overall performance of the via transition.;In the second paper, a rigorous modeling of the shared-antipad via structure is developed using surface partial element equivalent circuit (PEEC). The cavity Green’s function is used to evaluate the equivalent circuit elements, thereby requiring fewer cells for numerical computation. The non-orthogonal, quadrilateral cell is used in the mesh to better accommodate the non-rectangular shape of the via and the antipad. A novel wave port excitation method is applied to the equivalent circuit to obtain the network parameters of the via transition. The Z-parameters of the via structure are calculated using the proposed method, and the results are validated with the finite element solution obtained from commercial software.;In the third paper, an effective methodology is proposed to estimate the RF interference received by an antenna due to near-field coupling using divide-and-conquer based on reciprocity. The proposed methodology fits well with engineering practice, and is particularly suitable for pre-layout wireless system design and planning.