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Full wave analysis of transmission lines above a perforated ground plane.

机译:穿孔地面以上的传输线的全波分析。

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摘要

Planar transmission lines embedded in a dielectric sandwiched between conductive ground planes are used in high-speed microelectronic packaging to carry signals between integrated circuit chips. Ground planes may be perforated to allow signal connections between transmission lines on different layers through vias and also for structural integrity. In some cases of ceramic-based multilayer circuits composed of Low Temperature Cofired Ceramic (LTCC), fabrication technology requires the metal area in the interface be below 50% to maintain enough tape-to-tape contact during lamination to achieve a good bond between adjacent layers. Also, due to the different shrinkage and expansion behavior of glass and metal during firing and cooling, the metal area between two dielectrics should remain at a low value compared to the total dielectric area. Thus perforated ground planes are prevalent in modern electronic packaging.;Apertures on ground planes can definitely influence the characteristic impedance, propagation constant and signal velocity of a transmission line, and, also, coupling between transmission lines. Furthermore, transmission lines with perforated ground are not precisely planar transmission lines, which require uninterrupted ground planes; therefore traditional analytic approaches using Transverse Electric and Magnetic fields (TEM) or quasi-TEM methods of electromagnetic analysis for transmission lines fail to yield sufficiently accurate results. At high frequencies when coupling, radiation loss and surface waves become important, full-wave analysis must be used to take these effects into account.;An approach based on solution of mixed field integral equations using the Method of Moments and Green's functions derived for both electric and magnetic currents is proposed. The method of moments using the derived spectral domain formulation was implemented in the FORTRAN and the program has been used to analyze a multi-layer transmission line structure above a perforated ground plane problem. Dispersion and cut-off effects in the two-dimensional periodic structure have been discussed. The influences of line location and aperture geometries on the characteristics of transmission lines have been analyzed. The coupling effects of odd and even modes are also analyzed and discussed.
机译:嵌入在导电地平面之间的电介质中的平面传输线用于高速微电子封装中,以在集成电路芯片之间传输信号。接地平面可以打孔,以允许通过通孔在不同层上的传输线之间进行信号连接,也可以实现结构完整性。在某些情况下,由低温共烧陶瓷(LTCC)组成的基于陶瓷的多层电路,制造技术要求界面中的金属面积低于50%,以在层压期间保持足够的胶带与胶带接触,以实现相邻胶带之间的良好粘合层。同样,由于玻璃和金属在烧制和冷却过程中的收缩和膨胀行为不同,因此两种电介质之间的金属面积与总电介质面积相比应保持较低的值。因此,穿孔的接地层在现代电子包装中很普遍。接地层上的孔肯定会影响传输线的特性阻抗,传播常数和信号速度,以及传输线之间的耦合。此外,带有打孔接地的传输线不是精确的平面传输线,它需要不间断的接地层。因此,使用横向电磁场(TEM)或准TEM方法对传输线进行电磁分析的传统分析方法无法产生足够准确的结果。在高频率下,当耦合,辐射损耗和表面波变得重要时,必须使用全波分析来考虑这些影响。一种基于混合场积分方程解的方法,使用矩量法和格林函数推导得出提出了电磁电流。在FORTRAN中实现了使用导出的谱域公式的矩量法,该程序已用于分析穿孔地平面问题上方的多层传输线结构。讨论了二维周期结构中的色散和截止效应。分析了线的位置和孔径的几何形状对传输线特性的影响。还分析和讨论了奇数和偶数模式的耦合效应。

著录项

  • 作者

    Jiang, Li.;

  • 作者单位

    Lehigh University.;

  • 授予单位 Lehigh University.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2005
  • 页码 128 p.
  • 总页数 128
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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