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Low-power operation of microprocessor systems in the presence of process variation.

机译:在存在过程变化的情况下微处理器系统的低功耗操作。

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摘要

With the scaling of MOSFET dimensions and the performance enhancement features in the MOSFET, semiconductor manufacturing variation has also increased. Because of process variation and other reliability issues, circuits tend to move away from the nominal operating point, therefore degrading the parametric yield of the circuits. To assess the impact of process variations on the parametric yield of integrated circuits, an accurate process variation detection scheme is needed. This dissertation presents a new process variation detection and compensation technique. This technique uses the difference of the rise and fall slew as another metric along with delay in order to determine the magnitude and the relative mismatch between the drive strengths of the NMOS and PMOS devices. The importance of considering both of these metrics is illustrated, and a new slew-rate monitoring circuit is presented for use in measuring the difference of rise and fall slew on the critical path of the circuit. The measurement sensitivity of fabricated slew-rate monitor in a 65nm IBM CMOS technology is 0.11 V/microsecond with 1089 pF as the output load of the slew-rate monitor.;Six compensation schemes based on the delay or slew as the detection metric, with the ability to apply forward and reverse body-biasing, are analyzed in a 65 nm IBM CMOS technology. These schemes are capable of adjusting the critical path delay of the die to within any desired delay, as has been shown here within +/- 3% of the nominal delay, while reducing the total power dissipation by an average of ~8% across various process corners.;The compensation scheme is also extended to the within-die variation scenario. The chip is partitioned into multiple regions with localized sensors and a centralized supply voltage control with region-specific bias control is introduced to mitigate the impact of within-die (WID) process variation. The compensation algorithm determines the minimum required global supply voltage and the optimal body-biasing voltages for the individual regions. For a representative testbed circuit, this method achieves an average yield of 95% compared to that of 60% for the uncompensated circuit, while containing power budget to less than 15% above nominal power across all process corners and keeping the critical path delay in all modules short enough to meet the desired frequency.
机译:随着MOSFET尺寸的缩小以及MOSFET中性能的增强,半导体制造差异也随之增加。由于工艺变化和其他可靠性问题,电路往往会偏离标称工作点,因此会降低电路的参数产量。为了评估工艺变化对集成电路参数产量的影响,需要一种准确的工艺变化检测方案。本文提出了一种新的过程变化检测与补偿技术。为了确定NMOS和PMOS器件的驱动强度之间的大小和相对失配,该技术将上升和下降摆率的差异与延迟一起用作另一个度量。说明了同时考虑这两个指标的重要性,并提出了一种新的摆率监控电路,用于测量电路关键路径上的上升和下降摆率之差。在65nm IBM CMOS技术中,摆率监视器的测量灵敏度为0.11 V /微秒,摆率监视器的输出负载为1089 pF;基于延迟或摆率作为检测指标的六种补偿方案,在65 nm IBM CMOS技术中分析了施加正向和反向身体偏置的能力。这些方案能够将芯片的关键路径延迟调整为任何所需的延迟,如此处所示,在标称延迟的+/- 3%范围内,同时在各种情况下平均将总功耗降低了约8%。补偿方案也扩展到管芯内部变化方案。该芯片通过局部传感器分为多个区域,并引入了具有区域特定偏置控制的集中式电源电压控制,以减轻管芯内(WID)工艺变化的影响。补偿算法确定各个区域的最小所需全局电源电压和最佳人体偏置电压。对于有代表性的测试平台电路,该方法的平均良率为95%,而无补偿电路的平均良率为60%,同时在所有工艺角上的功率预算均低于标称功率的15%,并在所有过程中保持关键路径延迟模块足够短,可以满足所需的频率。

著录项

  • 作者

    Ghosh, Amlan.;

  • 作者单位

    The University of Utah.;

  • 授予单位 The University of Utah.;
  • 学科 Engineering Computer.;Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2010
  • 页码 137 p.
  • 总页数 137
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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