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Development of design approaches using porous silicon that facilitate high frequency integration in silicon substrates.

机译:使用多孔硅的设计方法的开发有助于硅衬底中的高频集成。

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摘要

Oxide capped porous silicon has the potential to produce low loss designs for high-density RF passive and CMOS integrated circuits. The RF/Microwave properties of circuit designs on porous silicon samples are investigated. Effective dielectric constant results of porous silicon films are shown in the range of 3.1-2.1 at 50 GHz. Measured and simulated attenuation results of porous and bulk silicon samples are presented with the porous samples showing up to 64% lower loss than low resistivity (10-20 O-cm) bulk silicon designs. Use of a 20 mum polyimide film on the porous silicon film produces an additional decrease in attenuation of 11%. DC bias effects on RF response of interconnects on the porous silicon film shows negligible RF variation (less than +/- 0.005 dB/cm) under bias conditions of +/- 19V. Parameters contributing to slow-wave mode propagation (substrate resistivity, dielectric film thickness and dielectric constant) in MIS circuits on silicon substrates are modeled and compared to the porous silicon samples which are found to diminish slow-wave mode propagation. Passive circuit performance is also investigated using inductors, capacitors and filters. Fabricated inductors on porous silicon film show quality factors as high as 30 with a self resonance of >45 GHz for an inductance of 0.6 nH. Lumped element models are developed to understand the performance of MIM capacitors on various substrates under a shunt and series implementation with a CPW feedline. The analysis shows that the MIM capacitor performance is impacted by the presence of various parasitic effects. Loss reduction methods using porous silicon for filter design on lossy substrates is investigated Reduction in the thickness of the lossy underlying bulk silicon leads to a 30% decrease in the insertion loss in the passband (at 10 GHz) and as 35% improvement in the stopband performance (35 GHz). In addition a 15 GHz aperture coupled patch antenna with its feed line on porous silicon is demonstrated. The measured return loss results show a resonant frequency of 14.78 GHz and a bandwidth of 0.85 GHz. Measured radiation patterns show an antenna with a high front to back ratio.
机译:覆有氧化物的多孔硅有潜力为高密度RF无源和CMOS集成电路产生低损耗设计。研究了多孔硅样品上电路设计的射频/微波特性。在50 GHz下,多孔硅膜的有效介电常数结果显示在3.1-2.1的范围内。给出了多孔硅和块状硅样品的测量和模拟衰减结果,与低电阻率(10-20 O-cm)块状硅设计相比,多孔样品的损耗降低了64%。在多孔硅膜上使用20μm的聚酰亚胺膜会使衰减进一步降低11%。直流偏置对多孔硅膜上互连线的射频响应的影响在+/- 19V的偏置条件下显示出可忽略的射频变化(小于+/- 0.005 dB / cm)。对硅基板上MIS电路中有助于慢波模式传播的参数(衬底电阻率,介电膜厚度和介电常数)进行建模,并将其与多孔硅样品进行比较,发现多孔硅样品可以减少慢波模式传播。还使用电感器,电容器和滤波器来研究无源电路的性能。多孔硅膜上制造的电感器的品质因数高达30,对于0.6 nH的电感,其自谐振> 45 GHz。开发了集总元件模型以了解在使用CPW馈线的并联和串联实施下,各种基板上MIM电容器的性能。分析表明,MIM电容器的性能受各种寄生效应的影响。研究了使用多孔硅在有损耗基板上进行滤波器设计的损耗减少方法,降低了底层有损耗大块硅的厚度,从而使通带(在10 GHz时)的插入损耗降低了30%,阻带提高了35%性能(35 GHz)。此外,还展示了一种15 GHz孔径耦合的贴片天线,其馈线位于多孔硅上。测得的回波损耗结果显示出14.78 GHz的谐振频率和0.85 GHz的带宽。测得的辐射方向图表明天线前后比很高。

著录项

  • 作者

    Itotia, Isaac Kamau.;

  • 作者单位

    University of Minnesota.;

  • 授予单位 University of Minnesota.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2005
  • 页码 161 p.
  • 总页数 161
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

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