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Equilibrium and metastable structures of Nickel/Silicon Dioxide/Silicon and Nickel/Silicon interfaces.

机译:镍/二氧化硅/硅和镍/硅界面的平衡和亚稳结构。

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摘要

Solid-state dewetting occurs in thin continuous metal films when capillary instabilities drive the nucleation and growth of holes. Dewetting of thick (>100nm) metals films has extensively been studied and is well understood, however the dewetting of ultra-thin films is not well understood. Recent studies have shown that Ni films less than 5nm thick do not dewet at the same temperatures as thicker Ni films, however it is not well understood why. A fundamental understanding of the dewetting behavior of ultra-thin metal films has key relevance in applications such as catalysis and complimentary metal-oxide semiconductor (CMOS) transistors. Self-assembly of metal islands can be created through the solid-state dewetting of thin metal films on a support substrate. These metal islands are used as catalyst to grow arrays of nanotubes and nanowires. Solid-state dewetting degrades the functional properties of NiSi films, which are used as contacts to the source and drain in CMOS transistors. Once the transistors are processed above 650°C the NiSi film will agglomerate, degrading the contacts to the source and drain. Alloying NiSi with refractory metals increases the dewetting temperature to over 900°C. The effect of Pt on the NiSi/Si interface structure and how the interface structure changes the functional properties of the interface is not understood. In this thesis Transmission Electron Microscopy (TEM) and aberration corrected Scanning TEM (STEM) are used to study the interface structure of ultra-thin films. In-Situ annealing, inside the TEM is used to observe morphological changes in ultra-thin Ni films sputtered onto SiO2/Si substrates. A new Aduro Double tilt heating holder, made by Protochips Inc., is implemented for studying solid-state dewetting, in situ. The Aduro heating holder is based off a Microelectromechanical systems (MEMS) design, where ultra-fast and controlled heating rates are obtained by resistively heating a SiC membrane with a low thermal mass. Advantages and limitations of the Aduro holder, and how to overcome them, are discussed. STEM, TEM, and Electron Energy Loss Spectroscopy (EELS) are used to study the Ni/SiO2/Si interface structure before and after the Ni film has dewetted. Aberration corrected STEM and EELS are used to study the Ni1-xPtxSi /Si interface structure, and how the pre-silicide layer differs from the previously observed diffusion layer. The effect of the Ni1-xPtxSi /Si interface structure on the Schottky barrier height is then discussed based off of the measured Schottky barrier heights.
机译:当毛细管不稳定性驱动孔的形核和生长时,固态去湿会在连续的金属薄膜中发生。厚金属(> 100nm)膜的去湿已被广泛研究并得到了很好的理解,但是超薄膜的去湿还没有被很好地理解。最近的研究表明,小于5nm厚的Ni膜在与较厚的Ni膜相同的温度下不会脱湿,但是为什么还不完全清楚。对超薄金属膜的去湿行为的基本了解与催化和互补金属氧化物半导体(CMOS)晶体管等应用有关。金属岛的自组装可通过对支撑基板上的金属薄膜进行固态去湿来实现。这些金属岛用作生长纳米管和纳米线阵列的催化剂。固态去湿会降低NiSi膜的功能特性,该膜用作CMOS晶体管的源极和漏极的触点。一旦晶体管在650°C以上的温度下进行处理,NiSi膜就会结块,从而使源极和漏极的触点退化。 NiSi与难熔金属合金化可将去湿温度提高到900°C以上。铂对NiSi / Si界面结构的影响以及界面结构如何改变界面的功能特性尚不清楚。本文采用透射电子显微镜(TEM)和像差校正扫描TEM(STEM)研究了超薄膜的界面结构。 TEM内部的原位退火用于观察溅射在SiO2 / Si衬底上的超薄Ni膜的形貌变化。由Protochips Inc.制造的新型Aduro双倾斜加热支架可用于就地研究固态去湿。 Aduro加热支架基于微机电系统(MEMS)设计,通过电阻加热低热质量的SiC膜获得超快且可控的加热速率。讨论了Aduro支架的优点和局限性,以及如何克服它们。 STEM,TEM和电子能量损失谱(EELS)用于研究Ni膜去湿前后的Ni / SiO2 / Si界面结构。像差校正的STEM和EELS用于研究Ni1-xPtxSi / Si界面结构,以及预硅化物层与先前观察到的扩散层有何不同。然后根据测得的肖特基势垒高度,讨论了Ni1-xPtxSi / Si界面结构对肖特基势垒高度的影响。

著录项

  • 作者

    Thron, Andrew Malachi.;

  • 作者单位

    University of California, Davis.;

  • 授予单位 University of California, Davis.;
  • 学科 Engineering Materials Science.;Chemistry Inorganic.
  • 学位 Ph.D.
  • 年度 2013
  • 页码 180 p.
  • 总页数 180
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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