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Fabrication and Characterization of Compound Thin-Film Transistors.

机译:复合薄膜晶体管的制造与表征。

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摘要

ZnO-based thin-film transistors (TFTs) have become attractive for use as driving devices in flat-panel display application, due to their high mobility and large area uniformity. Bottom-gate structures have been widely studied. However, this structure is unsuitable for the integration of peripheral circuits for the system on panel and realization of high resolution, large size, and low cost flat-panel display, due to their high parasitic capacitance and poor scalability.;A novel Al2O3/SiO2 gate dielectric structure is developed for realizing self-aligned top-gate ZnO TFT. The charge trapping at the interface between the channel layer and the gate dielectric is minimized due to the Al2O3 protective layer deposited immediately on top of the ZnO layer in the same sputtering chamber without breaking the vacuum. Additionally, self-aligned top-gate ZnO TFTs with Al2O 3 deposited by sputtering as gate dielectric showed high electrical performance, including field-effect mobility of 27 cm2/Vs and subthreshold swing of 0.12 V/decade.;Self-aligned top-gate amorphous indium gallium zinc oxide (a-IGZO) TFTs with SiNx/SiO2/SiNx/SiO2 passivation layers are developed. The source/drain regions were hydrogen-doped by CHF 3 plasma during the over-etching of gate dielectric. SiO2/Al 2O3 stack gate dielectric was used to produce high performance a-IGZO TFTs, such as subthreshold swing of 0.2 V/decade.;Self-aligned top-gate a-IGZO TFTs with source/drain regions doped by implanted phosphorus and arsenic are developed, respectively. The proposed a-IGZO TFTs showed much better thermal stability, as compared with those with S/D regions formed by hydrogen or argon plasma treatment. Litter change of the threshold voltage and subthreshold swing were observed after heat-treatment at 200 °C for 1 hour.;Finally, GaN thin films are utilized as active channel layer to produce n-type TFTs. GaN thin films were deposited by reactive dc magnetron sputtering technique at different substrate temperature. The bottom-gate GaN TFTs with SiO2 as gate dielectric exhibit good electrical performance, including field-effect mobility of 5 cm2/Vs, on/off current ratio of 6x106, and subthreshold swing of 0.4 V/decade. The GaN TFTs have great potential in the application of next generation flat-panel display.
机译:基于ZnO的薄膜晶体管(TFT)具有很高的迁移率和大面积均匀性,因此已成为平板显示应用中的驱动设备。底栅结构已被广泛研究。然而,由于这种结构的寄生电容高且可扩展性差,因此不适用于面板上系统的外围电路集成以及高分辨率,大尺寸和低成本平板显示器的实现。栅介电结构的开发是为了实现自对准顶栅ZnO TFT。由于Al2O3保护层直接沉积在同一溅射室内的ZnO层的顶部,而不会破坏真空,因此,在沟道层和栅极电介质之间的界面处捕获的电荷得以最小化。此外,通过溅射沉积的Al2O 3作为栅极电介质的自对准顶栅ZnO TFT具有良好的电性能,包括27 cm2 / Vs的场效应迁移率和0.12 V /十倍的亚阈值摆幅。开发了具有SiNx / SiO2 / SiNx / SiO2钝化层的非晶铟镓锌氧化物(a-IGZO)TFT。在栅极电介质的过蚀刻过程中,源极/漏极区域被CHF 3等离子体氢掺杂。 SiO2 / Al 2O3堆叠栅电介质用于生产高性能a-IGZO TFT,例如亚阈值摆幅为0.2 V /十倍;自对准顶栅a-IGZO TFT,其源/漏区掺杂有注入的磷和砷分别开发。与具有通过氢或氩等离子体处理形成的S / D区域的a-IGZO TFT相比,所提出的a-IGZO TFT显示出更好的热稳定性。在200°C热处理1小时后,观察到阈值电压的小幅变化和亚阈值摆幅。最后,将GaN薄膜用作有源沟道层以生产n型TFT。通过反应性直流磁控溅射技术在不同的衬底温度下沉积GaN薄膜。以SiO2作为栅极电介质的底栅GaN TFT具有良好的电性能,包括5 cm2 / Vs的场效应迁移率,6x106的开/关电流比和0.4V /十倍的亚阈值摆幅。 GaN TFT在下一代平板显示器的应用中具有巨大的潜力。

著录项

  • 作者

    Chen, Rongsheng.;

  • 作者单位

    Hong Kong University of Science and Technology (Hong Kong).;

  • 授予单位 Hong Kong University of Science and Technology (Hong Kong).;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2013
  • 页码 165 p.
  • 总页数 165
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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