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A common architecture for processing data from thin film sensor arrays tailored to three-dimensional applications.

机译:一种通用的体系结构,用于处理为三维应用量身定制的薄膜传感器阵列中的数据。

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摘要

Various thin film sensor arrays are studied, with emphasis on systems integratable on silicon. 3-D integration offers the chance to have all the data from the sensors in the sensor arrays available to the processing layer at once. The data from the sensors is read vertically directly into the processing layer. With the motivation to identify the needs of various thin film sensors and to exploit the available parallelism in data, thin film sensors are categorized into two---those with similar sensors in the arrays or those with different sensors in the sensor array. A common architecture to address both the categories is proposed, designed and implemented. Such a generic processing layer design also helps independent development of sensor arrays (of either categories) and finally deposited on such a generic processing layer.;Also any commercial off the shelf generic microprocessor can not be used for such a project. The reasons being that the generic microprocessors were not designed keeping in mind the vertical integration and hence parallelism in data. Nor are they designed to handle the specific needs of sensor arrays. The modSIMD processor (proposed and implemented in this thesis) exploits the 3-D integration aspects and the needs of sensor arrays. modSIMD stands for a modified SIMD (Single Instruction Multiple Data) architecture. In the common addressing mode, it behaves like a SIMD processor and works on various data elements parallelly. In the specific addressing mode, it behaves like a SISD (Single Instruction Single Data) processor.;First the advantages of 3-D integration are studied. The 3-D system architecture is compared to a 2-D system architecture with similar processing architecture. The 3-D architecture is seen to dissipate more power but is more efficient in area and speed. Then the processing architecture is put to test with applications from both the categories. It outperforms an ARM microprocessor in SIMD applications, thus exploiting the parallelism in data. modSIMD also works on applications from both the categories, thus developing such a common architecture is made possible.
机译:研究了各种薄膜传感器阵列,重点是可集成在硅上的系统。 3-D集成提供了将来自传感器阵列中传感器的所有数据立即提供给处理层的机会。来自传感器的数据直接垂直读取到处理层中。为了确定各种薄膜传感器的需求并利用数据中可用的并行性,将薄膜传感器分为两类-阵列中具有相似传感器的传感器或阵列中具有不同传感器的传感器。提出,设计和实现了解决这两个类别的通用体系结构。这种通用处理层设计还有助于独立开发传感器阵列(任一类)并最终沉积在这种通用处理层上。此外,任何现成的通用微处理器都不能用于此类项目。原因是通用微处理器的设计没有考虑到垂直集成以及数据的并行性。它们也不能满足传感器阵列的特定需求。 modSIMD处理器(本文提出并实现)利用了3D集成方面和传感器阵列的需求。 modSIMD代表一种经过修改的SIMD(单指令多数据)架构。在通用寻址模式下,它的行为类似于SIMD处理器,并并行处理各种数据元素。在特定的寻址模式下,它的行为类似于SISD(单指令单数据)处理器。;首先,研究了3-D集成的优势。将3-D系统架构与具有类似处理架构的2-D系统架构进行了比较。可以看到3-D架构耗散了更多功率,但在面积和速度上效率更高。然后,将处理架构用于这两个类别的应用程序的测试。在SIMD应用程序中,它的性能优于ARM微处理器,从而利用了数据的并行性。 modSIMD还可以在这两种类别的应用程序上工作,因此可以开发这种通用架构。

著录项

  • 作者

    Jammalamadaka, Rajasekhar.;

  • 作者单位

    University of Maryland, College Park.;

  • 授予单位 University of Maryland, College Park.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 M.S.
  • 年度 2006
  • 页码 99 p.
  • 总页数 99
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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