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Design Considerations of Graphene FETs for RF Applications.

机译:用于射频应用的石墨烯FET的设计注意事项。

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摘要

This dissertation discusses various physical aspects of graphene electronic devices, particularly FETs, of importance for high frequency (RF, microwave and mm-wave) applications. Device physics of graphene junctions and contact junctions are considered. Inhomogeneity effects, heat dissipation and graphene FET compact modeling including unique nonlinearity mechanisms are discussed.;The first part of the dissertation discusses device physics of graphene. The importance of its unique band structure, high carrier mobilities, and maximum current handling are highlighted for RF applications. Graphene junctions are discussed in detail, including p-n junctions and graphene-to-metal junctions. It is shown that graphene p-n junctions provide additional resistance at the transition region within representative FETs due to depletion of carriers, which results in asymmetric ambipolar Id-Vg curves. It is also shown that a charge transfer region is formed at metal-graphene edges, which produces errors in the customary contact resistance measurement and analysis. Both junction effects are controlled by carrier density of the film, fringe electric field, and bias conditions.;Inhomogeneous graphene films are modeled in detail to describe the formation of electron-hole puddles, and their impact on Hall mobility measurements. Inhomogeneity is more significant with larger amplitude of random charge fluctuation and the size of puddles. It is shown that measured Hall mobility can be degraded by more than 8 % due to inhomogeneity, compared with ideally uniform films with the same average carrier density.;Thermal properties of graphene FETs must also be understood in relation to their performance and reliability. Heat dissipation of graphene devices has been analyzed with 3-D thermal simulations. The significance of interface thermal resistance, device design for quick heat release, and contact metal use for lateral heat spreading is described. Simulation and experimental results showed that pulses as short as 200 ns can still heat up graphene devices due to their small heat capacity.;Finally, graphene device models are developed in two forms: a SPICE-like compact model for straightforward usage in circuit simulators, and a more abstract analytic model for investigation of the impact of device parameters on circuit performance. Both device models are used to explore the performance of graphene-based FETs in zero bias r.f. power detector and resistive linear mixer applications. Parasitic elements such as parasitic capacitances, gate and series resistances are included for realistic circuit simulation, and the role of these components on the circuit performance is investigated. Graphene-based zero-biased power detectors showed sensitivity comparable to those using CMOS and InP HEMT-based technologies. Simulated noise equivalent power (NEP) was estimated to be as low as 10 pW/Hz0.5 for a passive r.f. power detector, thanks to the suppression of flicker noise. The mixer also exhibited linearity comparable to state-of-the-art, with input third-order intercept point (IIP3) estimated at about 22 dBm. Simulation results describe the experimental results well. The impact of different device design parameters are investigated by simulation in order to optimize performance.
机译:本文讨论了石墨烯电子器件(尤其是FET)在高频(RF,微波和毫米波)应用中的各个物理方面。考虑了石墨烯结和接触结的器件物理性质。讨论了非均质性,散热和石墨烯场效应晶体管的紧凑模型,包括唯一的非线性机制。论文的第一部分讨论了石墨烯的器件物理。对于射频应用,强调了其独特的频带结构,高载流子迁移率和最大电流处理能力的重要性。详细讨论了石墨烯结,包括p-n结和石墨烯-金属结。结果表明,由于载流子耗尽,石墨烯p-n结在代表性FET的过渡区域提供了额外的电阻,这导致了不对称的双极性Id-Vg曲线。还显示出在金属-石墨烯边缘处形成电荷转移区,这在常规的接触电阻测量和分析中产生误差。两种结效应均受薄膜载流子密度,边缘电场和偏置条件的控制。详细建模非均质石墨烯薄膜,以描述电子空穴水坑的形成及其对霍尔迁移率测量的影响。随着随机电荷波动幅度的增大和水坑的大小,不均匀性变得更加明显。结果表明,与具有相同平均载流子密度的理想均匀薄膜相比,由于不均匀性,测得的霍尔迁移率可降低8%以上。;还必须了解石墨烯FET的热性能及其性能和可靠性。石墨烯器件的散热已通过3-D热仿真进行了分析。描述了界面热阻,快速散热的器件设计以及用于横向散热的接触金属的重要性。仿真和实验结果表明,短至200 ns的脉冲由于其较小的热容量仍可加热石墨烯器件。最后,石墨烯器件模型以两种形式开发:类似于SPICE的紧凑模型,可直接在电路仿真器中使用;还有一个更抽象的分析模型,用于研究器件参数对电路性能的影响。两种器件模型均用于探索零偏压r.f下基于石墨烯的FET的性能。功率检测器和电阻线性混频器应用。为了进行实际的电路仿真,还包括了诸如寄生电容,栅极和串联电阻之类的寄生元件,并研究了这些元件对电路性能的作用。基于石墨烯的零偏置功率检测器显示出的灵敏度可与使用基于CMOS和InP HEMT的技术相媲美。对于无源射频,模拟噪声等效功率(NEP)估计低至10 pW / Hz0.5。功率检测器,由于抑制了闪烁噪声。该混频器还表现出与最新技术相当的线性度,输入三阶交调点(IIP3)估计约为22 dBm。仿真结果很好地描述了实验结果。通过仿真研究了不同器件设计参数的影响,以优化性能。

著录项

  • 作者

    Lee, Kangmu Min.;

  • 作者单位

    University of California, San Diego.;

  • 授予单位 University of California, San Diego.;
  • 学科 Electrical engineering.
  • 学位 Ph.D.
  • 年度 2016
  • 页码 178 p.
  • 总页数 178
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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