首页> 外文学位 >A study of process variations and their impact analysis in RF circuits.
【24h】

A study of process variations and their impact analysis in RF circuits.

机译:对射频电路中的工艺变化及其影响分析的研究。

获取原文
获取原文并翻译 | 示例

摘要

This thesis presents an in-depth empirical research to understand the impact of process variations in RF Circuits. We present a hierarchical two phase approach to study the impact of process based variations on device characteristics and circuit-level performance as well. The simulations based on Monte-Carlo techniques have been conducted extensively at different levels to gauge the impact of process variations. Such sensitivity analysis helps to identify the critical components for various RF Cores at both layout/fabrication level, as well as circuit-level, which affect the performance of the system in the face of process based variations. This knowledge helps designers make necessary changes in the design phase to improve yield at the production stage. Thus, the hierarchical defect mapping based on device/component performance and sensitivity helps in optimizing circuit design by suitable consideration of component topologies for robust design. From a testing perspective, the defect analysis can help identify realistic faults which are bound to occur in RF Circuits. This helps to reduce the test signal generation effort to detect different types of faults in these circuits, which in turn results in cost savings in the testing process. This work also focuses on exploratory investigations to find alternative techniques to Monte-Carlo simulation based approach. Further, new ideas based on extending fault equivalence concepts between catastrophic and parametric faults for ease of test generation in RF Circuits have also been presented. (Abstract shortened by UMI.)
机译:本文提出了深入的实证研究,以了解射频电路中工艺变化的影响。我们提出了一种分层的两阶段方法来研究基于工艺的变化对器件特性和电路级性能的影响。基于蒙特卡洛技术的仿真已在不同级别进行了广泛的评估,以评估过程变化的影响。这种敏感性分析有助于在布局/制造级别以及电路级别识别各种RF核心的关键组件,这些组件在面对基于过程的变化时会影响系统的性能。这些知识可帮助设计师在设计阶段进行必要的更改,以提高生产阶段的产量。因此,基于器件/组件性能和灵敏度的分层缺陷映射可通过适当考虑组件拓扑以实现稳健设计,从而帮助优化电路设计。从测试的角度来看,缺陷分析可以帮助确定在RF电路中必然发生的实际故障。这有助于减少测试信号生成以检测这些电路中不同类型的故障的工作量,进而节省了测试过程的成本。这项工作还侧重于探索性调查,以寻找基于蒙特卡洛模拟的方法的替代技术。此外,还提出了基于在灾难性和参数性故障之间扩展故障对等概念的新思想,以简化RF电路中的测试生成。 (摘要由UMI缩短。)

著录项

  • 作者

    Gopalakrishnan, Srinivasan.;

  • 作者单位

    State University of New York at Buffalo.;

  • 授予单位 State University of New York at Buffalo.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 M.S.E.E.
  • 年度 2006
  • 页码 66 p.
  • 总页数 66
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号