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A new approach to electronic systems reliability assessment.

机译:电子系统可靠性评估的新方法。

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摘要

This research is aimed at improving the reliability of electronic systems, in general, with application to Printed Circuit Boards (PCB) in the electronic packaging and manufacturing industry. We consider the environment to be that of enterprises with complex supply chains, active design chains, and an e-business and e-engineering capability.;The main objective of this research is to design a framework for a hybrid approach combining Case-Based Reasoning (CBR) and Rule-Based System (RBS), in addition to Failure Modes and Effects Analysis (FMEA), Common-Mode Failures (CMF), and Highly Accelerated Life Testing (HALT) approaches, to dynamically identify possible causes of failure before a design is set for production, and to continuously learn from field and test failures and use this knowledge to prevent these failure causes from being incorporated in new designs.;We summarize research done in the area of electronic system reliability and assess the approaches used in the calculation of electronic system failure rates. A detailed literature survey was conducted to investigate the various available reliability prediction models. It includes the classification of the traditional models, discussion of the advantages and disadvantages, and a review and comparison of the key models. We also point out the assumptions used in the calculation of electronic system failure rates and propose a method to estimate the failure rate of a system that does not rely on the assumption of independent failures.;We add a new dimension of reliability to the Virtual Design Environment (VDE), a distributed, heterogeneous information architecture that simultaneously examines thousands of sourcing options for parts, suppliers, and assembly services based on an optimization over cost, and time-to-market. Reliability is added to make a three dimensional criteria set in guiding the design decisions for the design-supplier-manufacturing class of decision problems.;Lastly, the factors influencing Information Technology (IT) adaptation in organizations and changes required in organizational strategy and processes are discussed.
机译:总体而言,这项研究旨在提高电子系统的可靠性,并将其应用于电子包装和制造业中的印刷电路板(PCB)。我们认为环境是具有复杂的供应链,活跃的设计链以及电子商务和电子工程能力的企业的环境。;本研究的主要目的是设计一个结合基于案例的推理的混合方法的框架(CBR)和基于规则的系统(RBS),以及故障模式和影响分析(FMEA),共模故障(CMF)和高度加速寿命测试(HALT)方法,以便在故障发生之前动态识别故障的可能原因将设计用于生产,并将不断从现场学习和测试故障,并利用这些知识来防止将这些故障原因纳入新设计中。;我们总结了在电子系统可靠性领域所做的研究,并评估了用于以下方面的方法:电子系统故障率的计算。进行了详细的文献调查,以调查各种可用的可靠性预测模型。它包括传统模型的分类,优点和缺点的讨论以及关键模型的回顾和比较。我们还指出了用于计算电子系统故障率的假设,并提出了一种不依赖于独立故障假设的估计系统故障率的方法。我们在虚拟设计中增加了可靠性的新维度。环境(VDE)是一种分布式的异构信息体系结构,它基于成本和上市时间的优化,同时检查零件,供应商和装配服务的数千种采购选项。增加了可靠性,以制定一套三维标准,以指导设计供应商制造类决策问题的设计决策。最后,影响组织中信息技术(IT)适应性以及组织战略和流程所需变化的因素是讨论过。

著录项

  • 作者

    Goel, Anuj.;

  • 作者单位

    Rensselaer Polytechnic Institute.;

  • 授予单位 Rensselaer Polytechnic Institute.;
  • 学科 Engineering System Science.
  • 学位 Ph.D.
  • 年度 2007
  • 页码 162 p.
  • 总页数 162
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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