首页> 外文会议>World Tribology Congress III 2005 vol.2 >SURFACE ADHESION AND FRICTION IN MICROELECTROMECHANICAL SYSTEMS - MEASUREMENT AND MODIFICATION TECHNIQUES
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SURFACE ADHESION AND FRICTION IN MICROELECTROMECHANICAL SYSTEMS - MEASUREMENT AND MODIFICATION TECHNIQUES

机译:微机电系统中的表面粘附和摩擦-测量和修改技术

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Microscopic devices that can perform sensing, actuation, and control, known as microelectromechanical systems (MEMS), are projected to lead to new technologies with profound impacts in science and engineering. However, there are several limitations that must be overcome before MEMS could be fully utilized in various applications. In particular, because of the low stiffness and large surface-to-volume ratio of MEMS, high adhesion and friction forces between proximity and contacting surfaces limit the device efficiency and often lead to premature failure. Basic study of adhesion and friction under MEMS conditions requires special microdevices fabricated by surface micromachining. The basic features of such MEMS devices are presented herein together with suitable surface modification techniques for reducing surface adhesion and friction, such as surface texturing and deposition of low surface energy solid films and self-assembled monolayers.
机译:可以执行传感,致动和控制的微观设备(称为微机电系统(MEMS))预计将导致对科学和工程学产生深远影响的新技术。但是,要在各种应用中充分利用MEMS,必须克服一些限制。尤其是,由于MEMS的低刚度和大的表面体积比,邻近表面和接触表面之间的高附着力和摩擦力限制了器件效率,并经常导致过早失效。在MEMS条件下对附着力和摩擦力的基础研究需要通过表面微加工制造的特殊微型器件。此处介绍了此类MEMS器件的基本特征,以及用于降低表面附着力和摩擦力的合适表面改性技术,例如表面纹理化以及低表面能固体膜和自组装单层的沉积。

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