Development of close-to-zero damage rear heterojunction stripe contacts and compatible front metallization approaches for hybrid heterojunction solar cells

摘要

) show that close-to-zero damage rear-side heterojunction stripe contacts can be realized under optimized conditions. For the front-side metallization scheme, a low-temperature metallization approach, i.e. light-induced plating thickened by electroplating, is investigated to avoid degradation of the heterojunction layers by conventional high-temperature screen printing. It's demonstrated that plating can achieve comparable efficiencies with respect to conventional screen printing and can be applied directly to hybrid heterojunction solar cells using a rear-emitter configuration. For front-emitter configurations, a thin evaporated metal contact layer may be used as the seed layer for subsequent electroplating.