Thermal-structural Optimization of Light with LED Packaging

摘要

A systematic numerical and experimental method is developed to optimize a caution lamp with multichips LED chips. Here, we intend to describe the thermal performance of LED caution lamp with multiple LED chips through the structural optimization by the finite element method. One type of caution lamp was made and the highest temperatures of LED chips have been test after the optimization. This optimization method is useful for design and manufacturing of caution lamps with multiple LED chips. Compared with the simulation and the experiment data, the high temperature of LEDs were reduced by choosing fitting parameters. It indicates that the results and methods used in this paper can provide the guidance in the understanding of thermal management for LED lamps design.