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Thermal-structural Optimization of Light with LED Packaging

机译:LED封装的灯具热结构优化

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A systematic numerical and experimental method is developed to optimize a caution lamp with multichips LED chips. Here, we intend to describe the thermal performance of LED caution lamp with multiple LED chips through the structural optimization by the finite element method. One type of caution lamp was made and the highest temperatures of LED chips have been test after the optimization. This optimization method is useful for design and manufacturing of caution lamps with multiple LED chips. Compared with the simulation and the experiment data, the high temperature of LEDs were reduced by choosing fitting parameters. It indicates that the results and methods used in this paper can provide the guidance in the understanding of thermal management for LED lamps design.
机译:开发了一种系统的数值和实验方法,以优化带有多曲线LED芯片的小心灯。在这里,我们打算通过有限元方法通过结构优化来描述具有多个LED芯片的LED小心灯的热性能。制造了一种小心灯,优化后,LED芯片的最高温度已经进行了测试。这种优化方法可用于设计和制造具有多个LED芯片的小心灯。与模拟和实验数据相比,通过选择配合参数来减少LED的高温。它表明本文中使用的结果和方法可以提供对LED灯设计热管理的理解的指导。

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