首页> 外文会议>Wide-bandgap semiconductor materials and devices 11 -and-state-of-the-art program on compound semiconductors 52 (SOTAPOCS 52) >Investigation and Fabrication of Bottom Gate ZnO: Al TTFTs with Various Thicknesses of ZnO Buffer Layers
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Investigation and Fabrication of Bottom Gate ZnO: Al TTFTs with Various Thicknesses of ZnO Buffer Layers

机译:具有不同厚度的ZnO缓冲层的底栅ZnO:Al TTFT的研究与制作

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摘要

An Al doped ZnO (ZnO:Al) transparent thin film transistors (TTFTs) with various thickness of ZnO buffer layer sandwiched between gate insulator and channel layer were deposited by a magnetron radio frequency co-sputter system. When the thickness of the buffer layer was 80 nm, the field-effect carrier mobility of the TTFTs was as high as 122.0 cm~2/V-s. Furthermore, the associated gate voltage swing was 0.24 V/decade, and the maximum state density was 2.69×10~(11) eV~(-1)cm~(-2). The on-to-off current ratio of the TTFTs with 80 nm-thick ZnO buffer layer was up to 5×10~7.
机译:通过磁控管射频共溅射系统沉积具有各种厚度的ZnO缓冲层夹在栅极绝缘体和沟道层之间的Al掺杂ZnO(ZnO:Al)透明薄膜晶体管(TTFT)。当缓冲层的厚度为80nm时,TTFT的场效应载流子迁移率高达122.0cm 2 / V-s。此外,相关的栅极电压摆幅为0.24V /十倍,并且最大状态密度为2.69×10〜(11)eV〜(-1)cm〜(-2)。具有80nm厚的ZnO缓冲层的TTFT的通断电流比高达5×10〜7。

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