首页> 外文会议>VLSI Technology (VLSIT), 2012 Symposium on >Demonstration of improved heteroepitaxy, scaled gate stack and reduced interface states enabling heterojunction tunnel FETs with high drive current and high on-off ratio
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Demonstration of improved heteroepitaxy, scaled gate stack and reduced interface states enabling heterojunction tunnel FETs with high drive current and high on-off ratio

机译:演示了改进的异质外延,缩小的栅叠层和减少的界面状态,使异质结隧道FET具有高驱动电流和高开关比

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摘要

Staggered tunnel junction (GaAs0.35Sb0.65/In0.7Ga0.3As) is used to demonstrate heterojunction tunnel FET (TFET) with the highest drive current, Ion, of 135µA/µm and highest Ion/Ioff ratio of 2.7×104 (Vds=0.5V, Von−Voff=1.5V). Effective oxide thickness (EOT) scaling (using Al2O3/HfO2 bilayer gate stack) coupled with pulsed I–V measurements (suppressing Dit response) enable demonstration of steeper switching TFET.
机译:交错的隧道结(GaAs0.35Sb0.65 / In0.7Ga0.3As)用于演示异质结隧道FET(TFET),其最高驱动电流Ion为135µA / µm,最高Ion / Ioff比为2.7×10 4 (Vds = 0.5V,Von-Voff = 1.5V)。有效的氧化物厚度(EOT)缩放比例(使用Al2O3 / HfO2双层栅叠层)与脉冲I–V测量(抑制Dit响应)相结合,可以演示更陡峭的开关TFET。

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