首页> 外文会议>VLSI, 2009. ISVLSI '09 >A Non-Uniform Grid Based Ground Plane Model for High Performance Nodes: The Impact of Heterogeneous Cores on Ground Voltage Gradient
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A Non-Uniform Grid Based Ground Plane Model for High Performance Nodes: The Impact of Heterogeneous Cores on Ground Voltage Gradient

机译:高性能节点的基于非均匀网格的接地平面模型:异构铁心对接地电压梯度的影响

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With shift towards heterogeneous core architectures imminent, the uniform grid based ground plane model that is currently employed for chip-multiprocessors will no longer suffice. It is practically impossible to achieve absolute zero potential at all grid nodes of the uniform ground plane model with advent of heterogeneous cores. Differential injection of current into the ground plane by different heterogeneous core partitions results in voltage gradients across the ground plane, which is detrimental to the operation of the processor. The extremely stochastic spiking activity of different cores further accentuates the problem. To overcome the problem of varying voltage distribution across the ground plane, we propose a first-ever ground plane model structured as a non-uniform RLC interconnect grid. A simulated annealing optimization is employed with parameter of dasiatemperaturepsila as each node in the grid and impedance as the cost function psiladeltaepsila to arrive at the non-uniform grid structure.
机译:随着向异构核心架构的转变迫在眉睫,当前用于芯片多处理器的基于统一网格的接地平面模型将不再足够。随着异构核的出现,在统一接地平面模型的所有网格节点上实现绝对零电位实际上是不可能的。通过不同的异构铁心分区将电流差分注入接地层会导致整个接地层上的电压梯度,这对处理器的运行有害。不同磁芯的随机峰值活动进一步加剧了该问题。为了克服整个地平面上的电压分布变化的问题,我们提出了有史以来第一个构造为非均匀RLC互连网格的地平面模型。采用模拟退火优化方法,以dasiatemperaturepsila作为网格中的每个节点,以阻抗作为代价函数psiladeltaepsila作为参数,以达到非均匀网格结构。

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