THE ROLE OF CRYSTALLOGRAPHIC ORIENTATION ON THE FORCES GENERATED IN ULTRA-PRECISION GRINDING OF ANISOTROPIC MATERIALS SUCH AS MONOCRYSTALLINE SILICON

摘要

This work presents a system of measuring grinding forces in precision applications. Several experiments demonstrate the performance in monitoring diamond wheel dressing, detecting workpiece contact, and process monitoring. The system appears promising for monitoring precision wafer grinding since this approach provides excellent sensitivity, high signal resolution, and good bandwidth.