NANOINDENTATION RESPONSE OF DENDRIMER-MEDIATED SOFT METALLIC ULTRATHIN FILMS

摘要

In contrast to dendrimer-mediated Au films deposited on Si substrates, two other dendrimer-mediated metallic ultrathin films (Ti and Cu) do not exhibit improved resistance to nanoindentation penetration and restricted plastic flow. The contrary effect of dendrimer monolayers on the nanoindentation responses of these films suggests that the improved mechanical behaviors are not generic, and they especially depend on the relative hardness of the film and dendrimer and the original interfacial adhesion.