首页> 外文会议>Thirteenth European Conference on Chemical Vapor Deposition, Aug 26-31, 2001, Glyfada, Athens, Greece >The role of atomic surface structure in the metalorganic chemical vapor deposition of III-V compound semiconductors
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The role of atomic surface structure in the metalorganic chemical vapor deposition of III-V compound semiconductors

机译:原子表面结构在III-V型化合物半导体的金属有机化学气相沉积中的作用

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The atomic structure of gallium arsenide and indium phosphide (001) surfaces in the metalorganic chemical vapor deposition (MOCVD) environment has been characterized in situ by scanning tunneling microscopy and infrared spectroscopy. During growth at Ⅴ/Ⅲ ratios above 10, these films exhibit similar surface structures. They are terminated with alkyl groups, hydrogen atoms and group Ⅴ dimers (As or P) adsorbed on top of a complete layer of group Ⅴ atoms. As the Ⅴ/Ⅲ ratio decreases, the exposed arsenic and phosphorous atoms desorb from the surface. On gallium arsenide, this occurs through a phase transition, involving gallium out-diffusion and surface roughening. By contrast, on InP, the underlying phosphorous atoms simply form rows of dimers, yielding a smooth, continuous layer.
机译:在金属有机化学气相沉积(MOCVD)环境中砷化镓和磷化铟(001)表面的原子结构已通过扫描隧道显微镜和红外光谱进行了原位表征。在以Ⅴ/Ⅲ比大于10的比例生长期间,这些薄膜表现出相似的表面结构。它们被烷基,氢原子和吸附在完整的Ⅴ族原子层上的Ⅴ族二聚体(As或P)封端。随着Ⅴ/Ⅲ比值的降低,暴露的砷和磷原子将从表面解吸。在砷化镓上,这是通过相变发生的,包括镓的外扩散和表面粗糙。相比之下,在InP上,下面的磷原子仅形成二聚体行,从而产生光滑,连续的层。

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