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Modelling of temperature distribution in thermal microsensors on sandwich thermally isolated structures

机译:三明治式热隔离结构上的热微传感器中温度分布的建模

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摘要

The paper presents a modelling of temperature distribution in the sandwich thermally isolated structures used in thermal microsensors. The two cases are considered: 1) the temperature distribution along the thickness of a thermally isolated structure; 2) the temperature distribution over the area of a thermally isolated structure. The basis for modeling is the eigenfunction method which is modified for the structure including several regions with homogeneous parameters. The model is applied to the concrete microsensors with sandwich thermally isolated structure. The relative error in determining the temperature distribution in replacing the two-layer structure (Si/SiO2) by the structure with homogeneous parameters is evaluated. The temperature distributions in the regions with the thermopiles and heater and along the line of disposition of hot thermojunctions of the thermopile are determined.
机译:本文提出了一种用于热微传感器的夹层隔热结构中温度分布的模型。考虑了两种情况:1)沿隔热结构厚度的温度分布; 2)隔热结构区域内的温度分布。建模的基础是特征函数方法,该方法针对包含多个具有均匀参数的区域的结构进行了修改。该模型适用于具有夹层热隔离结构的混凝土微传感器。评估在用均匀参数的结构代替两层结构(Si / SiO2)时确定温度分布时的相对误差。确定具有热电堆和加热器的区域中以及沿着热电堆热热结的布置线的温度分布。

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