首页> 外文会议>Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009 >Thermal simulation and package investigation of wireless gas sensors microsystems
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Thermal simulation and package investigation of wireless gas sensors microsystems

机译:无线气体传感器微系统的热仿真和封装研究

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Gas sensor arrays based on metal oxides operating at high temperature are commonly used in many application fields. They can operate on different principles and each sensor may show very different responses to the individual gases in the environment. Data coming from the array can be merged for reliable gas detection. One point which is common to the different sensors types is that the atmosphere to be sensed must flow on or through the sensor itself. This work investigates air flows in gas sensor packages, and proposes a new package to improve gas exchange through natural convection, aiming to allow the gas detection in the case of very small gas concentrations. The study is based on multiphysics Finite Element Method simulations using a commercial software tool.
机译:基于高温工作的金属氧化物的气体传感器阵列通常用于许多应用领域。它们可以按照不同的原理进行操作,并且每个传感器对环境中的各种气体可能显示出截然不同的响应。来自阵列的数据可以合并以进行可靠的气体检测。不同传感器类型共有的一点是,要感测的气氛必须在传感器本身上或通过传感器流动。这项工作研究了气体传感器包装中的气流,并提出了一种新包装以通过自然对流改善气体交换,目的是在气体浓度非常小的情况下进行气体检测。该研究基于使用商用软件工具进行的多物理场有限元方法仿真。

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