首页> 外文会议>Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009 >Crack tip localization of sub-critical crack growth by means of IR-imaging and pulse excitation
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Crack tip localization of sub-critical crack growth by means of IR-imaging and pulse excitation

机译:通过红外成像和脉冲激励实现亚临界裂纹扩展的裂纹尖端定位

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Taking the advantage of the thermo-elastic effect, while using an infrared camera system, the mechanical stress could be made visible. The stress concentrations at the tip of a subcritical crack growth could clearly be detected. Through the observation during the periodic loading of a CT-specimen the crack growth rate can be determined. For this purpose, a specially developed loading stage will be presented. It is now possible to have further investigation in material class of polymers, which is very important in the field of system integration. First promising results will be presented.
机译:利用热弹性效应的优势,在使用红外摄像系统时,可以使机械应力可见。可以清楚地检测到亚临界裂纹扩展尖端的应力集中。通过在CT试样的定期加载过程中进行观察,可以确定裂纹的扩展速率。为此,将介绍一个专门开发的装载阶段。现在可以对聚合物的材料类别进行进一步的研究,这在系统集成领域非常重要。将提出第一个有希望的结果。

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