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Rapid method for sub-critical fatigue crack growth evaluation

机译:亚临界疲劳裂纹扩展评估的快速方法

摘要

In a method and system for evaluating sub-critical fatigue crack growth in a semiconductor device, a plurality of energy pulses generated by an energy source are repeatedly impinged onto the semiconductor device for a predefined time interval. The repeated impinging of the plurality of energy pulses induces a mechanical stress within the semiconductor device. The induced mechanical stress, maintained below a threshold and repeated for a predefined number of cycles, causes a formation of a sub-critical fatigue crack within the semiconductor device. A detector detects the presence of the sub-critical fatigue crack leading to a fatigue failure. A rapid determination of a pass or fail status for a fatigue test of the semiconductor device is made by comparing a total number of cycles to fatigue failure to a predefined benchmark.
机译:在用于评估半导体器件中的亚临界疲劳裂纹扩展的方法和系统中,在预定的时间间隔内,将由能量源产生的多个能量脉冲重复地冲击到半导体器件上。多个能量脉冲的反复冲击在半导体器件内引起机械应力。保持在阈值以下并重复预定次数的循环的感应机械应力导致在半导体器件内形成亚临界疲劳裂纹。检测器检测导致疲劳失效的亚临界疲劳裂纹的存在。通过将疲劳失效的循环总数与预定基准进行比较,可以快速确定半导体器件疲劳测试的通过或失败状态。

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